Sponsor
Rehm-Thermal-Systems-GmbH

Flux-Free, Reliable, Efficient: Soldering with Formic Acid
Whitepaper shows formic-acid-assisted, flux-free soldering enables reliable, nearly void-free joints for power semiconductors. The technology improves thermal performance and lifespan.
Rehm Thermal Systems
Rehm-Thermal-Systems-GmbH
Sponsor
BEST-Inc.

How to Simplify Solder Paste Printing
StikNPeel removable rework stencils simplifies selective printing of solder paste leaving no residue providing cleaner alternative to metal stencils.
BEST Inc.

Ask the Experts Panel

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The Ask the Experts panel includes hundreds of experienced and knowledgable professionals from the world of electronics manufacturing. Combined they have thousands of years of experience and offer their input on a wide range of topics.

X Number or responses submitted
Fern Abrams 1
Director, Government Relations and Environmental Policy, IPC
Brianna Anderson 15
Senior Process Engineer, Circuit Technology Center
Avery Armes 1
IPC Training Coordinator, Adco Circuits Inc.
Steve Arneson 2
National Business Manager, ASC International
Gustavo Arredondo 1
Technical Manager, Para Tech Coating, Inc.
Gregory Arslanian 16
Global Segment Manager, Air Products & Chemicals, Inc.
Clive Ashmore 5
Global Process Manager, ASM
Paul Austen 83
Senior Project Engineer, Electronic Controls Design Inc
Amit Bahl 15
Director of Sales and Marketing, Sierra Circuits
David Bao 21
Director New Product Development, Metallic Resources, Inc
Brian Bauer 1
Business Manager, Heraeus Incorporated
Kevin Beattie 11
Quality Manager, Sunstone Circuits
Joe Belmonte 14
Principal Consultant, ITM Consulting
David Bergman 3
VP International Relations, IPC
Dr. David Bernard 5
Product Manager, Dage Precision Industries
Hartmut Berndt 9
President, B.E.STAT group
Peter Biocca 34
Senior Market Development Engineer, Kester
Mike Bixenman 10
CTO, Kyzen Corp.
Bob Black 28
North America Sales Manager, Essegi Automation
Sven Bock 3
Director of Quality / CLSSMBB, FCT Companies
Robert Boguski 1
President, Datest
David Bonito 9
Sales & Marketing Manager, Technical Manufacturing Corp.
Carlos Bouras 29
General Manager, Nordson SELECT
Al Bousetta 2
Director of Marketing, Nordson March
Richard Boyle 28
Global Product Champion, Henkel Electronics
Jade Bridges 15
European Technical Support Specialist, Electrolube Ltd
Mike Burgess 5
Regioanl Sales Manager, ASM Assemby Systems
Richard Burke 7
National Sales Manager, Datapaq
Brien Bush 27
Manufacturing Applications Specialist, Cirtronics Corp.
Fritz Byle 200
Process Engineer, Astronautics
Al Cabral 16
Regional Sales Manager, Finetech
Christopher B Cain 1
R&D Manager, Agilent Technologies
Eric Camden 8
Lead Investigator, Foresite, Inc
Aaron Caplan 2
Director of Marketing & Training, PACE Worldwide
Dr. Bill Cardoso 1
CEO, Creative Electron
Zhongwei Chen 3
Process Supervisor, NexPCB Co; Ltd
Demetrius Chrysostomou 1
Director of Technology, PVA TePla
Bill Coleman 61
Vice President Technology, Photo Stencil
Steve Cook 4
Director of Product Technology, Techspray
Jack Crawford 8
Director - Certification & Assembly Technology, IPC
Tod Cummins 18
Director of Corporate Quality Assurance, Delta Group Electronics Inc.
Mark J. Curtin 5
President, Transition Automation, Inc.
Bjorn Dahle 29
President, inspīre solutions LLC
John De Leeuw 5
Manufacturing Process Engineer, TE SubCom
Mitch DeCaire 7
Sales Manager (Americas), Cogiscan, Inc.
James DiBurro 5
President, Round Rock Consulting
Paul Dickerson 8
Supply Chain Engineer, Matric Group
Fred Dimock 14
Manager, Process Technology, BTU International
Doug Dixon 47
Marketing, 360-Biz
Mahesh V Draksharapu 3
Independent Consultant
Chris Ellis 6
Sales Manager, Manncorp
Daniel (Baer) Feinberg 9
President and Founder, Fein-Line Associates
Jeff Ferry 6
President, Circuit Technology Center, Inc.
Mark Finstad 8
Senior Applications Engineer, Flexible Circuit Technologies
Jack Fisher 2
Chairman of the IPC Technology Roadmap Committee, Interconnect. Technology Analysis Inc.
Anki Forsberg 5
Senior Quality Engineer - PCB Assembly, Axis Communications
Tom Forsythe 10
Vice President, Kyzen Corporation
Gary Freedman 29
President, Colab Engineering
Robert Freid 8
President and Founder, Contract Manufacturing Consultants, Inc.
Mark Frimann 1
Product Stewardship Management, Texas Instruments
Mahendra Gandhi 7
SME - PWB Technologies, Northrop Grumman
Gerald Gardener 2
Sales Manager, JBC Tools Inc
Sjef van Gastel 4
Manager Advanced Development, Assembleon
Gary Goldberg 12
President and CEO, PROMATION, Inc.
Mike Green 6
Design Engineering, Lockheed Martin Space Systems
Peter Greenland 7
Global Sales Director, Photonis USA
Eddie Groves 2
Director of the Selective Soldering Academy (SSA), Selective Soldering Academy
Emmanuelle Guene 2
Application Manager, Inventec Performance Chemicals
Jim Hall 1
Principal Consultant, ITM Consulting
Steve Hall 3
President, EKRA America
Larry Harman 7
SMT Engineer, ACDi
Richard Heimsch 11
Director, Protean Marketing
Richard Henrick 2
Quality Assurance/Regulatory Compliance Manager, Sanmina Corporation
Jim Hevel 1
Research Chemist, Indium Corporation of America
Dr. Craig D. Hillman 83
CEO & Managing Partner, DfR Solutions
Lee Hitchens 6
Owner, SCH Technologies
Mitch Holtzer 24
Director of Reclaim Business, Alpha Assembly Solutions
Greg Hueste 21
Senior Applications Engineer, Speedline Technologies
T.J. Hughes 16
Manufacturing Engineer, Esterline Interface Technologies
Harold Hyman 13
Consultant, VJ Electronix
Michael Jawitz 1
Electronics Engineer Corporate PWB BDE, Boeing Research and Development
Terry Jeglum 17
President/CEO, Electronic Technology Corporation
Tim Jensen 4
Product Manager, Advanced Assembly Materials, Indium Corp.
Harry Jin 1
Product Manager, CheckSum LLC
Mike Jones 54
Vice President, Micro Care
Michael Kaminsky 10
Sr Field Applications Support Engineer, Kester Inc.
Jerry Karp 42
President, JSK Associates
Bryan Kerr 30
Principal Engineer - CMA Lab, BAE Systems
Phil Kinner 11
Global Business Director conformal coatings division, Electrolube
Paul J. Koep 15
Global Product Manager, Alpha
Rick Kompelien 16
Principal Product Engineer, Benchmark Electronics, Inc.
Mike Konrad 36
President, Aqueous Technologies
Parasuraman Krishnan 2
Engineer, Process Development, Sanmina India Pvt ltd
Leo Lambert 202
Vice President, Technical Director, EPTAC Corporation
Robert "Bob" Lazzara 23
President, Circuit Connect, Inc.
Tony Lentz 73
Field Applications, FCT Assembly
Bob LePage 9
Sales Engineer, Circuit Technology Center
Lee Levine 9
President, Consultant, Process Solutions Consulting Inc.
EH Lim 14
Managing Director, Asia Pacific, ECD
Grant Main 13
Technical Sales Manager, Fineline VAR Ltd
Edithel Marietti 94
Senior Manufacturing Engineer, Northrop Grumman
Garry McGuire 7
Sr. Engineer, NASA/Marshall Space Flight Center
Mark McMeen 24
VP Engineering Services, STI Electronics Inc.
Renee Michalkiewicz 7
General Manager, Trace Laboratories
Rodney Miller 41
Capital Equipment Operations Manager, Specialty Coating Systems
Kevin Mobley 23
PCBA Engineering Liaison, General Atomics Electromagnetic Systems Group
Francois Monette 3
VP Sales & Marketing, Cogiscan
Terry Munson 64
President/Senior Technical Consultant, Foresite
Keshava Murthy 7
Process Engineer, Bosch Automotive Electronics India Ltd.
Kathy Nargi-Toth 1
Director Quality and Technology, NCAB Group USA
Stephanie Nash 16
Director, Integrated Ideas & Technologies, Inc.
Don Naugler 11
General Manager, VJ Technologies, Inc.
Bob Neves 1
CEO/CTO, Microtek Laboratories
Simon G. Norman 3
International Director, EVS International
Mark Norris 5
Vice President Asia, Nordson Advanced Technologies
Mark Northrup 21
Fellow, Raytheon
John Norton 23
Eastern Manager, Vitronics Soltec
Neil O'Brien 15
Sales Director, Finetech
Gerard O'Brien 40
President, S T and S Testing and Analysis
Brian O'Leary 11
Global Account Manager, Indium Corporation
Todd O'Neil 12
National Sales and Marketing Manager, North America, Business Development Manager, DAGE | X-Ray component counting
Tim O'Neill 21
Director of Product Management, AIM
Michelle Ogihara 5
Sales and Marketing Manager, Seika Machinery Inc.
Carson Orud 1
SmartDRY Product Manager, ECD
Chris Palin 28
European Manager, HumiSeal
Kay Parker 48
Technical Support Engineer, Indium Corporation
Doug Pauls 19
Principal Materials and Process Engineer, Collins Aerospace
Swaroop Pawar 11
PCBA Industrialization, Schneider Electric
Marc Peo 35
President, Heller Industries Inc.
Rick Perkins 30
President, Chem Logic
Grant Peterson 2
Vice President; Marketing & Sales, ECD
Walter Pierowski 4
Process Engineer, Esterline Interface Technologies
Kevin Pigeon 3
Senior Applications Manager, AIM Solder
Pierce Pillon 16
Laboratory Mgr., Techspray
Charlie Pitarys 30
Technical Expert Sales Support, Kyzen Corporation
Steve Pollock 6
Vice President, Essemtec USA
Neil Poole 38
Senior Applications Chemist, Henkel Electronics
Ray Prasad 9
President, Ray Prasad Consultancy Group
Andy Price 17
Sales Engineer, Circuit Technology Center
Kris Roberson 33
Manager of Assembly Technology, IPC
Andres Rojas 17
Engineering Director / Master IPC Trainer (MIT), AMMSA Solutions
Scott Rushia 3
Sales Manager - Martin Products, Martin
Brook Sandy 5
Technical Education Program Manager, IPC - Association Connecting Electronics Industries
Kishan Sarjoo 20
Process Engineering Manager - Electronics, Altech UEC, South Africa
Tom Schardt 1
Industrial Engineer, Red Lion Controls, Inc.
Manuel Schöllig 5
Product Manager Soldering, Inventec Dehon
Stephen Schoppe 6
President, Process Sciences, Inc.
Bill Schreiber 18
President, Smart Sonic Corporation
Mike Scimeca 48
President, FCT Assembly
Karl Seelig 47
Deck Street Consultants
John Sharp 2
Corporate Product Compliance Manager, TriQuint Semiconductor, Inc.
Guy Shemesh 5
General Manager, ePiccolo Engineering
Georgian Simion 139
Engineering and Operations Management, Independent Consultant
Michael Sivigny 2
General Manager, CeTaQ Americas
Brian Smith 43
General Manager - Electronic Assembly Americas, DEK International
Simon Smith 2
Marketing Manager, Pillarhouse International Ltd
Bhanu Sood 4
Laboratory Director, CALCE, University of Maryland
Patinya Srianan 2
Customer Technical Support Engineer, Alpha Assembly Solution
Steve Stach 20
President, Austin American Technology
Richard D. Stadem 147
Advanced Engineer/Scientist, General Dynamics
Mark Stansfield 7
Founder / Director, SolderStar Ltd
David Suihkonen 4
President, R&D Technical Services Inc.
Sandip Thakor 7
Quality Engineer, Matrix Telecom Solution P Ltd
Dr. Oommen Tharakan Kuttiyil Thomas 5
Group Director, Vikram Sarabhai Space Centre
Umut Tosun 54
Application Technology Manager, Zestron America
Peter Vigneau 7
Vice President, Circuit Technology Center
Karthik Vijay 45
Technical Manager - Europe, Indium Corp.
John Vivari 23
Application Engineering Supervisor, Nordson EFD
Raju Wagh 4
Senior Engineer SMT, Advance Power Display system Ltd Mumbai
Wayne Wagner 15
President, Krayden Inc.
Mark Waterman 24
M.O.L.E. Line Product Manager, Electronic Controls Design, Inc. (ECD)
Dr. Eyal Weiss 6
CTO, Cybord
David Whalley 1
Senior Lecturer, Loughborough University
Jim Williams 36
Chairman, Polyonics, Inc.
Lee Wilmot 10
Director, EHS, TTM Technologies
Scott Wischoffer 12
Marketing Manager, Fuji America Corporation
Jonathan Wol 1
President, Pillarhouse USA, Inc.
Paul Wood 2
Advanced Applications Manager, OK International
Linda Woody 4
SME Production Technical Excellence Staff, Lockheed Martin
Greg York 99
Technical Sales Manager, BLT Circuit Services Ltd
Edward Zamborsky 120
Regional Sales Manager, OK International Inc.
Phil Zarrow 10
Principal Consultant, ITM Consulting
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Sponsor
Plasma-Etch

Plasma Etch PE-Avenger
The PE-Avenger is an ultra low-cost entry level plasma cleaning system allowing more labs to utilize plasma. It's a low frequency plasma cleaner designed for surface activation and organics removal.
Plasma Etch
kyzen