Sponsor

Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond

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Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
KYZEN

Ask the Experts Member

Scott Rushia

Sales Manager - Martin Products

Martin

Scott Rushia is a Sales Manager with Martin and is responsible for sales and service for Martin's rework and dispensing products. He has over 11 years of experience in the SMT industry and was in the semiconductor industry for 10 years.

Scott Rushia has submitted responses to the following questions.

Package-on-Package Rework
Yes you can rework only the top package. It can easily be removed with a combination vacuum cup (for removal) ...

Contract Assembly in a Prison
Yes, there are inexpensive techniques and machines to meet your requirements. We have a wide range of products that can ...

Application of Flux for Hand Soldering
Yes, one method to dispense flux is with a hand held time pressure system (with suck back vacuum so low ...

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Sponsor

Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH

The Essential Guide for High-Reliability BGA Component Re-balling