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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE
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Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering
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Ask the Experts Member |
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Scott Rushia
Sales Manager - Martin Products
Martin
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Scott Rushia is a Sales Manager with Martin and is responsible for sales and service for Martin's rework and dispensing products. He has over 11 years of experience in the SMT industry and was in the semiconductor industry for 10 years.
Scott Rushia has submitted responses to the following questions.
Package-on-Package Rework
Yes you can rework only the top package. It can easily be removed with a combination vacuum cup (for removal) ...
Contract Assembly in a Prison
Yes, there are inexpensive techniques and machines to meet your requirements. We have a wide range of products that can ...
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IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
Alltemated
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