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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.
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Ask the Experts Member |
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Scott Rushia
Sales Manager - Martin Products
Martin
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Scott Rushia is a Sales Manager with Martin and is responsible for sales and service for Martin's rework and dispensing products. He has over 11 years of experience in the SMT industry and was in the semiconductor industry for 10 years.
Scott Rushia has submitted responses to the following questions.
Package-on-Package Rework
Yes you can rework only the top package. It can easily be removed with a combination vacuum cup (for removal) ...
Contract Assembly in a Prison
Yes, there are inexpensive techniques and machines to meet your requirements. We have a wide range of products that can ...
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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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