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High-Reliability for Low-Temp Processes
Durafuse® LT low-temp, high-rel solder paste is bismuth-free, reduces warpage in large BGAs, enhances thermal cycling, drop shock reliability, and reduces energy use up to 15%.
Indium Corporation
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Sponsor |
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Low Outgassing, Silver Filled Silicone
Master Bond MasterSil 323S-LO is an electrically and thermally conductive, addition cured adhesive designed for bonding applications where low stress is critical.
Master Bond
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Ask the Experts Member |
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Scott Rushia
Sales Manager - Martin Products
Martin
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Scott Rushia is a Sales Manager with Martin and is responsible for sales and service for Martin's rework and dispensing products. He has over 11 years of experience in the SMT industry and was in the semiconductor industry for 10 years.
Scott Rushia has submitted responses to the following questions.
Package-on-Package Rework
Yes you can rework only the top package. It can easily be removed with a combination vacuum cup (for removal) ...
Contract Assembly in a Prison
Yes, there are inexpensive techniques and machines to meet your requirements. We have a wide range of products that can ...
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