May 20, 2025

China Semiconductor Ambition and Adversity China is rapidly expanding its semiconductor industry through aggressive state-led investment, aiming for self-sufficiency amid global export controls. It's advancing in mature nodes, packaging, and 7nm chip production using DUV tech, despite lacking cutting-edge EUV capabilities. EE Times

Sponsor TIM1 for EV Battery Thermal Management AIT's thermal adhesives, grease-gels, & gum-pads offer proven thermal dissipation for a balance of strength, rework ability, & recyclability of EV battery packs. AI Technology

11 Myths About Electronic Design Automation EDA tools power the semiconductor industry's innovation engine, enabling advanced chip design, verification, and manufacturing. Despite persistent myths, the sector thrives through AI integration, cloud adoption, startup growth, and critical support for next-gen technologies. Electronic Design

The Economics of Electronic Component Salvage and Reuse This paper explores the feasibility and benefits of salvaging and reconditioning the leads and pads of electronic components, focusing on high-value components such as microprocessors, microcontrollers, and artificial intelligence chips. Technical Paper

Microsoft introduces GitHub AI agent that can code for you GitHub launched a new AI coding agent at Microsoft Build that tackles programming tasks, notifies developers when done, and integrates changes directly into code. Powered by Claude 3.7, it's available in preview for Copilot Pro+ and Enterprise users. CNBC

Sponsor Is My PCB Wash Concentration in Check Evaluating wash concentration levels through varying testing methods can potentially save process time, reduce overall process costs, and increase cleaning efficacy on PBCs. Read more. KYZEN

How AI Can Help You Cut Through Tariff Chaos — in Just 3 Simple Steps President Trump's shifting tariffs have thrown U.S. entrepreneurs into chaos, forcing rapid changes to pricing and supply strategies. Sudden cost spikes and policy reversals are paralyzing long-term planning and threatening business stability across industries. Entrepreneur

Technical Papers ■ The Economics of Electronic Component Salvage and Reuse ■ Cutting Without Contact: How Laser Depanelling Redefines PCB Manufacturing ■ The "Fried Egg" Effect in Soldering ■ Flux Technology Development for Solder Paste Compatible with Formic Acid Reflow Ovens for Power Devices ■ Innovative Power Module Assembly Solutions ■ Unlocking the Potential of Nanoscale Conformal Coatings ■ Recycling vs Circularity: Minimising E-Waste in Manufacturing ■ Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components ■ Probe Card Manufacturer 'Sees the Unseen' With X-ray ■ Electronic Assembly Cleaning Basics: Manual Concentration Monitoring Methods MORE TECHNICAL PAPERS

Sponsor Thermally Conductive Epoxy Master Bond Supreme 11AOHTLP is a two component adhesive featuring thermal conductivity and electrical insulation for high performance bonding, sealing and coating. Master Bond

Prototype Computer Uses Noise to Its Advantage Normal Computing unveiled a thermodynamic computer prototype that harnesses natural noise to solve matrix inversion and AI-related tasks. This innovative, physics-based method could complement CPUs, GPUs, and quantum chips in future hybrid computing systems. IEEE Spectrum

Groundbreaking new battery design will make EVs much lighter Structural batteries could revolutionize EV design by doubling as the vehicle's frame, cutting weight by 20% and boosting range by up to 70%. Researchers in Sweden are leading the charge, with startups racing to commercialize the breakthrough. BGR

Sponsor Vapor Phase Profiling Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more. ECD

Google I/O 2025: How to watch and what to expect Google I/O 2025 kicks off in Mountain View, spotlighting AI and the Gemini ecosystem. While major hardware reveals like the Pixel 10 are unlikely, expect deep dives into Android XR, Chrome, Google Cloud, and developer productivity tools. BGR

India's OSAT Ambitions: Flying High or a Flight Risk? India is pushing hard into semiconductors with $18.2 billion in approved OSAT and fabrication projects. Backed by government subsidies, firms like Suchi and Kaynes target niche markets while Tata and CG Power pursue global scale, aiming to reshape chip packaging. EE Times

Sponsor AVOID THE VOID® with Proven Solder Paste Looking to achieve void reduction and enhanced SIR performance? Indium8.9HF is your proven, no-clean, Pb-free, halogen-free, solder paste solution. Indium Corporation

The Most Revolutionary Products Don't Come From 'Eureka' Moments. Here's What You're Not Seeing. Tech conferences glamorize innovation, turning years of hard, methodical development into flashy origin stories. Founders spotlight "aha moments," skipping over the grind of testing, failures, and quiet teamwork that actually drive technological breakthroughs behind the scenes. Entrepreneur

Trump's massive import taxes haven't done much economic damage — yet Despite warnings, U.S. inflation cooled and hiring remained strong in April, contradicting fears about Trump's tariffs. Economists caution, however, that high, unpredictable tariffs are still rippling through the system and could impact future inflation trends. AP News

Sponsor Inline Automatic X-Ray Inspection: TruView™ Verus TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed. Creative Electron

Will Future Delivery Vehicles All Look Like This? Applied EV has unveiled the Blanc Robot, a fully autonomous, customizable delivery van with no driver cabin, aiming to cut costs and boost utility. Partnering with Oxa, the startup plans large-scale deployment, pending legal and infrastructure readiness. Auto Week

Nvidia teams up with Foxconn to build an AI supercomputer in Taiwan Nvidia CEO Jensen Huang announced a major partnership with Foxconn to build a Taiwan-based AI supercomputer powered by 10,000 Blackwell GPUs. The project will bolster Taiwan's AI infrastructure, support TSMC R&D, and deepen Nvidia's global AI footprint. Tom's Hardware

Through Hole Connector Solder Joint Hole Fill When looking at IPC610D in relation to through hole connectors and Class III level soldering. What is the recommended inspection method to ensure the 75% fill requirement is being met? For many through hole connectors one side is totally covered. Circuit Insight - Ask the Experts

Sponsor Micro Dispensing Technology Leader DL Technology LLC develops customized dispensing needles and valves for the electronics assembly, industrial assembly, semiconductor packaging and medical industries. DL Technology

Nvidia announces new tech to keep it at the center of AI development At Computex 2025, Nvidia CEO Jensen Huang unveiled NVLink Fusion, enabling Nvidia GPUs to work with third-party CPUs and ASICs, expanding AI infrastructure flexibility. Nvidia also launched DGX Cloud Lepton and revealed an AI supercomputer partnership with Foxconn. CNBC

Modern Methods of PCB Depanelization with a Focus on Low Impact Depanelization It is easier and more economical to manufacture multiple assemblies simultaneously on a larger panel and then singularize them once they’ve been populated. Circuit Insight - Analysis Lab

Memory Safety Will Be Key to Tackle Fundamental Cyber Security The U.K.'s Digital Security by Design initiative showcased CHERI, a memory-safe hardware technology, in London. Experts praised its cybersecurity potential but noted adoption challenges. With 160+ companies involved, standardizing memory safety remains a key priority. EE Times