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Need a low-maintenance machine?
Searching for a reliable and low maintenance machine? Look no further. Infotech Automation is your trusted partner for innovative and flexible automation solutions.
Infotech Automation Inc.
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Ask the Experts
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Manual or Automated Assembly?
We are a new start-up assembling wireless sensors. All assembly is now manual, we have no automation. We are at a point where we are experiencing large ...
Responses by:
Mark Waterman M.O.L.E. Line Product Manager, Electronic Controls Design, Inc. (ECD) Fritz Byle Process Engineer, Astronautics KN Murli Head-Quality, Astra Microwave Products, Hyderabad, AP India Stephanie Nash Director, Integrated Ideas & Technologies, Inc. T.J. Hughes Manufacturing Engineer, Esterline Interface Technologies Steve Pollock Vice President, Essemtec USA Robert "Bob" Lazzara President, Circuit Connect, Inc. Mark J. Curtin President, Transition Automation, Inc.
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MORE ASK THE EXPERTS
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Plasma Etch PE-Avenger
The PE-Avenger is an ultra low-cost entry level plasma cleaning system allowing more labs to utilize plasma. It's a low frequency plasma cleaner designed for surface activation and organics removal.
Plasma Etch
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Latest 3D AOI System from Viscom
iS6059 PCB Inspection Plus. Its new and faster sensor technology, data processing and analysis functions all stand for the best 3D AOI performance that meets the highest requirements.
Viscom
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What Year Was It?
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Levi Strauss Receives Patent for Blue Jeans
San Francisco businessman Levi Strauss and Reno, Nevada, tailor Jacob Davis are given a patent to create work pants reinforced with metal rivets, marking the birth of one of the world's most famous garments: blue jeans.
See the answer below.
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What Year Was It Answer
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Levi Strauss Receives Patent for Blue Jeans Answer: May 20, 1873
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May 20, 2025
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China Semiconductor Ambition and Adversity
China is rapidly expanding its semiconductor industry through aggressive state-led investment, aiming for self-sufficiency amid global export controls. It's advancing in mature nodes, packaging, and 7nm chip production using DUV tech, despite lacking cutting-edge EUV capabilities.
EE Times
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TIM1 for EV Battery Thermal Management
AIT's thermal adhesives, grease-gels, & gum-pads offer proven thermal dissipation for a balance of strength, rework ability, & recyclability of EV battery packs.
AI Technology
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11 Myths About Electronic Design Automation
EDA tools power the semiconductor industry's innovation engine, enabling advanced chip design, verification, and manufacturing. Despite persistent myths, the sector thrives through AI integration, cloud adoption, startup growth, and critical support for next-gen technologies.
Electronic Design
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The Economics of Electronic Component Salvage and Reuse
This paper explores the feasibility and benefits of salvaging and reconditioning the leads and pads of electronic components, focusing on high-value components such as microprocessors, microcontrollers, and artificial intelligence chips.
Technical Paper
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Microsoft introduces GitHub AI agent that can code for you
GitHub launched a new AI coding agent at Microsoft Build that tackles programming tasks, notifies developers when done, and integrates changes directly into code. Powered by Claude 3.7, it's available in preview for Copilot Pro+ and Enterprise users.
CNBC
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Is My PCB Wash Concentration in Check
Evaluating wash concentration levels through varying testing methods can potentially save process time, reduce overall process costs, and increase cleaning efficacy on PBCs. Read more.
KYZEN
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Thermally Conductive Epoxy
Master Bond Supreme 11AOHTLP is a two component adhesive featuring thermal conductivity and electrical insulation for high performance bonding, sealing and coating.
Master Bond
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Prototype Computer Uses Noise to Its Advantage
Normal Computing unveiled a thermodynamic computer prototype that harnesses natural noise to solve matrix inversion and AI-related tasks. This innovative, physics-based method could complement CPUs, GPUs, and quantum chips in future hybrid computing systems.
IEEE Spectrum
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Groundbreaking new battery design will make EVs much lighter
Structural batteries could revolutionize EV design by doubling as the vehicle's frame, cutting weight by 20% and boosting range by up to 70%. Researchers in Sweden are leading the charge, with startups racing to commercialize the breakthrough.
BGR
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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process especially those with vacuum is challenging. ECD's M-VP sealed barrier can take it. Learn more.
ECD
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Google I/O 2025: How to watch and what to expect
Google I/O 2025 kicks off in Mountain View, spotlighting AI and the Gemini ecosystem. While major hardware reveals like the Pixel 10 are unlikely, expect deep dives into Android XR, Chrome, Google Cloud, and developer productivity tools.
BGR
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India's OSAT Ambitions: Flying High or a Flight Risk?
India is pushing hard into semiconductors with $18.2 billion in approved OSAT and fabrication projects. Backed by government subsidies, firms like Suchi and Kaynes target niche markets while Tata and CG Power pursue global scale, aiming to reshape chip packaging.
EE Times
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AVOID THE VOID® with Proven Solder Paste
Looking to achieve void reduction and enhanced SIR performance? Indium8.9HF is your proven, no-clean, Pb-free, halogen-free, solder paste solution.
Indium Corporation
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Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron
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Will Future Delivery Vehicles All Look Like This?
Applied EV has unveiled the Blanc Robot, a fully autonomous, customizable delivery van with no driver cabin, aiming to cut costs and boost utility. Partnering with Oxa, the startup plans large-scale deployment, pending legal and infrastructure readiness.
Auto Week
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Nvidia teams up with Foxconn to build an AI supercomputer in Taiwan
Nvidia CEO Jensen Huang announced a major partnership with Foxconn to build a Taiwan-based AI supercomputer powered by 10,000 Blackwell GPUs. The project will bolster Taiwan's AI infrastructure, support TSMC R&D, and deepen Nvidia's global AI footprint.
Tom's Hardware
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Through Hole Connector Solder Joint Hole Fill
When looking at IPC610D in relation to through hole connectors and Class III level soldering. What is the recommended inspection method to ensure the 75% fill requirement is being met? For many through hole connectors one side is totally covered.
Circuit Insight - Ask the Experts
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Micro Dispensing Technology Leader
DL Technology LLC develops customized dispensing needles and valves for the electronics assembly, industrial assembly, semiconductor packaging and medical industries.
DL Technology
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Memory Safety Will Be Key to Tackle Fundamental Cyber Security
The U.K.'s Digital Security by Design initiative showcased CHERI, a memory-safe hardware technology, in London. Experts praised its cybersecurity potential but noted adoption challenges. With 160+ companies involved, standardizing memory safety remains a key priority.
EE Times
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Today's Sponsor |
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Sponsor |
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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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Test Your Knowledge
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What is a microelectrode?
See answer below.
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Quote of the Day
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"Talent is cheaper than table salt. What separates the talented individual from the successful one is a lot of hard work." Stephen King
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You need clear soldering results?
The SEHO PowerVision AOI system is for fast, automated optical inspection. Designed for THT processes & focusses on 2 points: Continuous quality assurance & cost-efficient production processes.
SEHO Systems GmbH
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Cartoon of the Day
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"Yes, it's cold in here. We're having the company cryogenically frozen until the economy gets better."
Copyright © Randy Glasbergen
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Test Your Knowledge Answer
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What is a microelectrode? Answer: The microelectrode is a small device that electrically (or chemically) stimulates a living cell and records the electrical activity within that cell.
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