November 14, 2025

Why COP30 Matters to the Electronics Industry and How Manufacturers Can Lead COP30 pushes electronics makers to prove real progress on decarbonization, circular design, and supply-chain transparency. Companies like LG, Jabil, Flex, and Koh Young show how digital twins, renewable energy, and waste-cutting innovations are reshaping sustainable manufacturing. Global Electronics Assocation

Sponsor Unlock the Potential of Salvaged Devices Component harvesting is a reliable method of electronic component reclamation, reducing e-waste and ensuring economic reuse for automated assembly. BEST Inc.

Two Visions for the Future of AR Smart Glasses Smart-glasses makers are betting on two paths: discreet AI companions or portable screen replacements. As AR tech improves and prices fall, companies like Halliday and Xreal push competing designs, hoping consumers finally embrace useful, everyday eyewear computers. IEEE Spectrum

The Economics of Electronic Component Salvage and Reuse This paper explores the feasibility and benefits of salvaging and reconditioning the leads and pads of electronic components, focusing on high-value components such as microprocessors, microcontrollers, and artificial intelligence chips. Technical Paper

New Report Claims iPhone 16e Isn't Selling Well, But Does It Matter? Apple's iPhone 16e reportedly faces weak sales, but its niche, budget-focused design means limited demand was expected. Despite mixed performance, Apple plans to proceed with the iPhone 17e, aiming to retain cost-conscious users who might otherwise switch to Android. BGR

Sponsor Pioneering 3D X-ray Inspection for Flat Assemblies Viscom is setting a new standard for high-precision inline X-ray inspection of printed circuit boards with its iX7059 product line. Learn more. Viscom

China is doing everything to stand on its own China intensifies its self-reliance push as Xi Jinping elevates technology, drives domestic innovation, and deepens military-civil fusion to counter U.S. pressure. Despite economic strains, Beijing accelerates efforts to cut foreign dependence and reshape global supply chains. Taipei Times

Technical Papers ■ The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible ■ PCB Rework Evolves, With X-ray a Constant Support ■ How pH Cleaning Agents Affect Production Performance ■ A Universal AI-Powered Segmentation Model for PCBA & Semiconductor ■ RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG ■ High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin ■ Understanding Solder Dross: Causes and Control Strategies ■ Optimizing BGA Rework: Challenges, Techniques and Quality Control ■ Maintenance: The Basics of Cleaning Series Part 4 ■ The Economics of Electronic Component Salvage and Reuse MORE TECHNICAL PAPERS

Sponsor Inline Automatic X-Ray Inspection: TruView™ Verus TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed. Creative Electron

3 Engineer-Approved AI Tools to Master 'Vibe Coding' — and 7 Steps to Use Them AI giants OpenAI, Anthropic, Meta and Google are racing to build advanced tools for multi-file projects. An engineer says the surge in "vibe coding" now supports complex machine-learning work, enabling major time and cost savings through three practical solutions. Entrepreneur

Gartner Forecasts IT Spending in Europe to Grow 11% in 2026 Europe's IT spending is set to hit $1.4T in 2026, up 11.1% from 2025, driven by AI, cloud, and cybersecurity. Gartner forecasts GenAI spending to surge 78.2%, public cloud services to grow 24%, and AI-optimized server demand to rise, as nations push for regional AI platforms. Gartner

Sponsor REL61: Cost-Effective Soldering, Elevated Performance Many low/no-silver alternatives save money but fall short in performance. REL61 is different, offering both lower costs and better performance. AIM Solder

China's Tech Giants Race to Replace Nvidia's AI Chips China moves to cut reliance on Nvidia as state pressure, security concerns, and export limits push firms toward domestic AI chips. Huawei leads the transition with its Ascend lineup and massive supercomputing clusters, though industry players remain cautious about full adoption. IEEE Spectrum

Spectrum Decisions Demand Science, Not Scapegoats The FCC weighs NextNav's push to use lower-900 MHz for high-power PNT, moving carefully amid warnings it could disrupt existing IoT devices. Regulators pursue broader, data-driven tests of multiple GPS backup options before committing to any single approach. EE Times

Sponsor Die-Module Attach (Pastes & Films) Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding. AI Technology, Inc.

Are SSDs Really More Reliable Than Hard Drives? Backblaze's study found that solid-state drives (SSDs) generally outlast hard disk drives (HDDs), with lower annual failure rates—0.92% versus 3.55% after five years. However, SSD reliability varies by usage, environment, and model, underscoring the importance of regular data backups. BGR

Samsung tri-fold phone leak reveals name, iPad-like screen size, and launch date Samsung is preparing to launch the Galaxy Z TriFold on December 5, featuring a 10-inch inner display, 200MP camera, and 5,437mAh battery. Limited to South Korea and China, the $3,000 tri-fold device debuts in small quantities. TechSpot

Sponsor AIT ORMET® TLPS for Component Attach AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC Ormet® TLPS

A.I. Deployment in Verification Tool for Inspection Equipment AI has been deployed in the verification tool with studies conducted to compare the effectiveness and efficiency of the tool versus human operation. Circuit Insight - Production Floor

This new PC design snaps together like Lego and has zero visible cables Asus and streamer DIY-APE advanced a cable-free PC concept with the Back-Plug 3.0 prototype, which channels up to 2,000W through a single rear connector. The snap-together system enhances backward compatibility and showcases a working, nearly cableless custom PC design. TechSpot

Solid-State Diffusion between Rolled Cu and Electroplated Matte-Sn System This study focusses on the IMC phase growth in rolled Cu- electroplated Sn system during the temperature range from 398K to 473K. Circuit Insight - Analysis Lab

Sponsor Tough Engineering Changes? Where Can You Turn? Engineering changes are a reality that need to be dealt with. Do you have qualified rework technicians to do the job efficiently and reliably? Circuit Technology Center

Chinese tech giant Tencent's quarterly revenue rises 15%, fueled by AI Tencent posts 15% revenue growth as AI lifts ad targeting, gaming, and cloud sales. Core services hit 95.9B yuan, international gaming jumps 43%, and financial services climb 10% on expanding payment offerings as AI adoption accelerates across its platforms. CNBC

Microsoft speeds up AI chip development with OpenAI IP licensing Microsoft is speeding up its AI chip program by licensing OpenAI’s proprietary chip and system design innovations, CEO Satya Nadella said. The deal gives Microsoft rights to all collaborative system-level IP, enabling faster development of its AI accelerators and computing architectures. Digitimes

Memory Safety Will Be Key to Tackle Fundamental Cyber Security The U.K.'s Digital Security by Design initiative showcased CHERI, a memory-safe hardware technology, in London. Experts praised its cybersecurity potential but noted adoption challenges. With 160+ companies involved, standardizing memory safety remains a key priority. EE Times