circuitnet
Sponsor
BEST-Inc.

How to Simplify Solder Paste Printing
StikNPeel removable rework stencils simplifies selective printing of solder paste leaving no residue providing cleaner alternative to metal stencils.
BEST Inc.
Nordson-ASYMTEK
Sponsor
Essegi-Automation

Scaling SMT Traceability
High-mix electronics manufacturing requires precise material control. This whitepaper explains how Tecnimaster improved traceability, inventory accuracy and picking efficiency through integrated automated storage and reel-level tracking.
Essegi Automation

News Index

PRIOR
  Page 1 of 3797  
NEXT
INDEX


30376 news listings.

To search a phrase, place it in quotes.
Apr 17, 2026
India's Electronics Push Shifts to Design, but Ownership Gap Remains
India is shifting its electronics strategy toward design ownership as MeitY approves a ₹7,104 crore ECMS tranche. Industry leaders stress building IP, fostering independent design houses, and overcoming talent and funding gaps to capture higher value beyond manufacturing.
EE Times

Apr 17, 2026
China smartphone market shifts to premium, Huawei and Apple lead in 1Q26
China's smartphone shipments fell 3.3% to 69 million in Q1 2026, but strong premium demand for Huawei and Apple devices cushioned the decline. Vendors are shifting toward profitability, prioritizing high-end models, pricing discipline, and operational efficiency over volume growth.
Digitimes

Apr 17, 2026
Revolutionary Battery Breakthroughs, or Maybe Not?
Rising competition for attention fuels exaggerated battery "breakthrough" claims that overlook technical limits and scaling hurdles. Experts stress most innovations face long, uncertain paths, with real progress arriving steadily through incremental gains, not sudden leaps.
EE Times

Apr 17, 2026
What's The Difference Between Wi-Fi 6 And Wi-Fi 6E?
Wi-Fi 6E enhances Wi-Fi 6 by adding a 6GHz band, reducing congestion and improving speeds for compatible devices. It benefits high-speed plans and crowded networks, but requires supported routers and devices, offering limited advantages for older hardware or slower connections.
BGR

Apr 17, 2026
Meta's Broadcom Liaison Enters Next AI Phase
Broadcom expands its AI lead by extending a long-term chip design deal with Meta, scaling MTIA accelerators for massive workloads. The partnership targets over 1 GW of capacity, boosting generative AI, improving efficiency, and personalizing experiences for billions.
EE Times

Apr 17, 2026
Is Your Body Language Sabotaging You? This Nonverbal Communication Expert's Method Has Helped Her Clients Generate $2 Billion in Sales.
As a firstborn daughter, Clemons developed strong people-pleasing instincts and a natural ability to mediate family dynamics. She became highly attuned to body language, quickly recognizing when others' words conflicted with their facial expressions or posture.
Entrepreneur

Apr 17, 2026
Apple accelerates environmental progress with highest‑ever recycled material in its products
Apple advances its sustainability push, reporting 30% recycled materials across 2025 products, eliminating plastic packaging, and cutting emissions. The company accelerates progress toward its Apple 2030 carbon-neutral goal through innovation and supply chain collaboration.
Apple

Apr 17, 2026
How Intel Got Into Trouble: We Test the Last Decade of Intel Flagship CPUs
Intel's decade-long CPU evolution highlights modest early gains with the Intel Core i7-7700K, whose slight performance boost and thermal issues disappointed users, even as it remained capable in modern gaming and marked the end of Intel's quad-core dominance.
TechSpot

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Summit-Interconnect

Seven Facilities, One Trusted Source
Partner with the industry leader. Summit is trusted and proven, with 7 integrated facilities to load capacity—from fast-turn prototypes to scalable production requirements.
Summit Interconnect
Indium-Corporation