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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
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6 Common Mistakes of BGA Rework
BGA rework is one of the most challenging procedures you may need to master. Doing it right depends in large part on the skills and knowledge of the rework technician. Learn more ...
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