| Sponsor |
|
Thixotropic, Dual Cure Adhesive
Master Bond UV23FLDC-80TK is a dual curing adhesive that withstands rigorous thermal cycling and is suitable for applications where low stress is critical. View full specs.
Master Bond
|
|
Search |
Use the search box below to search for information based on your interest.
To search a phrase, place it in quotes.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
|