Circuitnet Ask the Experts

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Ask the Experts Index

■	Use of Nitrogen for Hand Soldering
■	Suggested Limit for PCBA Heat Cycles
■	QFN Test Failures Caused by Flux
■	Competing Reflow Oven Zones
■	Confused About IPC-A-610 Class 2 vs. Class 3
■	Burned Chip Repair
■	Idle Wave Solder Temperature
■	IPC 610 Class 3 with Missing Non-functional BGA Pads
■	BGA Component Cleaning Spec
■	Aluminum Trays and Rapid Static Discharge
■	Seeking Advise for a Solder Reflow Recipe
■	Cleanliness Standards for Electronic Components
■	Fastening Surface Mounted Connectors Before or After Refow?
■	Concerns With Silver Finish Component Leads
■	Hot Air Soldering for 0201s and 01005s
■	What is the IPC Definition of Uncommonly Harsh?
■	QFN Open Solder Joints
■	BGA Component Grounding Problem
■	Solder Mask Ghosting
■	Is Component Lead Damage Reparable?
■	Challenges with 01005 Components
■	Components Jumping Around During Reflow
■	Moisture Barrier Bag Calculation
■	Acceptable Conductor Repair
■	Question About Dry Storage of PCBA's
■	MELF Component Misalignment
■	Delamination After V-cut
■	Allowable Bow and Twist on Round PC Fab
■	Is There a Spec for LDI Mask thickness?
■	Production Floor Temperature and Humidity Loggers
■	How To Reduce Solder Joint Voids in QFN Components
■	Reduce Glare During Assembly
■	How To Rework SMT Connector with Center Ground Strip
■	Two Year Component Date Code Mandate
■	IPC SOIC Defect Question
■	OA Flux Turning Blue
■	Conformal Coating Over No-Clean Flux
■	Copper Dissolution Rate
■	Matte Black Solder Mask Defects
■	BGA Solder Ball Collapse
■	ESD Ground Wire Gauge
■	Conformal Coating Press Fit Connectors
■	Recommended Fiducial Shape
■	PCBA Inspection Process Causing Damage
■	Can a Few Contaminated Joints Cause an Assembly to Fail RoHS Compliance?
■	Ultrasonic Cleaning and Surfactants
■	Low Operating Temperature Lead-Free Solder
■	BGA Reballing Question
■	Requirement for Toe Fillets
■	EMI Shield Reflow Soldering Techniques

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Automated Storage for High-Mix EMS Production
High mix electronics manufacturing requires reliable material management. This white paper explains how BMK enhanced traceability, inventory accuracy and picking efficiency using integrated automated storage, digital workflows, reel-level visibility.
Essegi Automation