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Ask the Experts Index

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876 expert questions.

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Apr 19, 2030
Manual or Automated Assembly?
We are a new start-up assembling wireless sensors. All assembly is now manual, we have no automation. We ...
R.M.

May 19, 2025
Inspection for Hidden Solder Joints
We are integrators working on automating the assembly for a high-volume medical device that requires multiple boards to ...
B.S.

May 16, 2025
Flux Residue During Pin-in-Paste
Our application is for pin-in-paste reflow using tin/lead no-clean, solder paste. Is it standard practice to increase the ...
M.W.

May 15, 2025
Soldering Station Calibration
To calibrate or not, that is the question. When our company purchased new soldering stations two years ago ...
A.A.

May 14, 2025
Design Considerations and Impact on Assembly
What are the most common design decisions that can have a negative impact on the PCB assembly and ...
G.B.

May 13, 2025
What Causes Component Rotation During Reflow?
We are using a large 2 pin SMT inductor. During reflow soldering it rotates almost 30 degree. We ...
S.S.

May 12, 2025
Through Hole Connector Solder Joint Hole Fill
When looking at IPC610D in relation to through hole connectors and Class III level soldering. What is the ...
R.D.

May 9, 2025
How To Remove Oxidation On SMT Components
What process do you recommend for removing oxidation from SMT components? These components are unsolderable due to the ...
R.J.

May 8, 2025
Stencil Cleaning Procedure
Currently, as needed, our EMS contractor wipes the bottom side (board contact side) of each solder paste stencil ...
P.M.

May 7, 2025
Bottom Terminated Components and Vias
Should the thermal vias of bottom terminated components be tented on both sides to prevent flux trapping and ...
N.P.

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