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Apr 12, 2021 Viscosity of Solder Paste Before Printing What is the general recommended viscosity of solder paste before printing. ... I.M. Apr 9, 2021 Bottom Terminated Components and Vias Should the thermal vias of bottom terminated components be tented on both sides to prevent flux trapping and ... N.P. Apr 8, 2021 Is Solder Mask Considered an Insulator If solder from a PTH lead, on the source side, touches solder mask that is over a copper ... E.C. Apr 7, 2021 Reduce Glare During Assembly We have a problem with excessive glare during hand assembly operations, particularly when placing components by hand, and ... P.W. Apr 6, 2021 BGA BAll Sheer Testing We soldered a lead-free 548-ball BGA. Afterreflow, we mechanically pulled the BGA component off the circuit board surface.See ... T.S.Y. Apr 5, 2021 Components Jumping Around During Reflow We reflowed a set of boards using a lead-free solder process and had issues with components jumping around ... M.D. Apr 2, 2021 Floor Life of MSD Parts We run small jobs so a reel of MSD components could be opened and closed a number of ... M.B. Apr 1, 2021 QFN Open Solder Joints We are experiencing opens on assembled QFN components at a rate of approx 9%. This component has 2 ... M.N. Mar 31, 2021 Delamination Causing Scrap We have been experiencing delamination on our printed board assemblies causing scrap. Is there a way to definitively ... D.H. Mar 30, 2021 Adhesion Problems with Conformal Coating We have a large RF back plane that is gold plated on the operational side. We are having ... T.A. |
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