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Ask the Experts Index |
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May 20, 2026 Rise of Bismuth Levels in our Solder Pots We have an issue of concentrating bismuth in our selective solder machines. We have two machine and both ... J.G. May 15, 2026 Inspection for Hidden Solder Joints We are integrators working on automating the assembly for a high-volume medical device that requires multiple boards to ... B.S. May 14, 2026 Solution for Warped PCBAs From a large lot we have 20 populated boards with components on both sides that are warped. Components ... E.J. May 13, 2026 BGA Component Cleaning Spec Is there a standard or or specification covering requirements for BGA cleaning after rework? ... E.C. May 12, 2026 Tin Whiskers and Vapor Phase Reflow Can we solder components with tin-plated leads using Sn63Pb37 solder paste in vapor phase reflow (215C) without a ... M.B May 11, 2026 Soldering Station Calibration To calibrate or not, that is the question. When our company purchased new soldering stations two years ago ... A.A. May 8, 2026 Solder Paste Stencil Inactivity How long can we leave solder paste on a stencil without any activity, wiping, etc.? ... S.K. May 7, 2026 Solder Mask Thickness Tolerance Our standard PCB fabrication drawing indicates solder mask of 0.8mil thickness. If this is an acceptable standard note, ... J.L. May 6, 2026 Question About ESD Ionizer Guns When using pressurized air to clean circuit boards, is it necessary to use an air ionizer gun to ... B.W. May 5, 2026 Bottom Terminated Components and Vias Should the thermal vias of bottom terminated components be tented on both sides to prevent flux trapping and ... N.P. |
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