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886 expert questions.

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May 20, 2026
Rise of Bismuth Levels in our Solder Pots
We have an issue of concentrating bismuth in our selective solder machines. We have two machine and both ...
J.G.

May 15, 2026
Inspection for Hidden Solder Joints
We are integrators working on automating the assembly for a high-volume medical device that requires multiple boards to ...
B.S.

May 14, 2026
Solution for Warped PCBAs
From a large lot we have 20 populated boards with components on both sides that are warped. Components ...
E.J.

May 13, 2026
BGA Component Cleaning Spec
Is there a standard or or specification covering requirements for BGA cleaning after rework? ...
E.C.

May 12, 2026
Tin Whiskers and Vapor Phase Reflow
Can we solder components with tin-plated leads using Sn63Pb37 solder paste in vapor phase reflow (215C) without a ...
M.B

May 11, 2026
Soldering Station Calibration
To calibrate or not, that is the question. When our company purchased new soldering stations two years ago ...
A.A.

May 8, 2026
Solder Paste Stencil Inactivity
How long can we leave solder paste on a stencil without any activity, wiping, etc.? ...
S.K.

May 7, 2026
Solder Mask Thickness Tolerance
Our standard PCB fabrication drawing indicates solder mask of 0.8mil thickness. If this is an acceptable standard note, ...
J.L.

May 6, 2026
Question About ESD Ionizer Guns
When using pressurized air to clean circuit boards, is it necessary to use an air ionizer gun to ...
B.W.

May 5, 2026
Bottom Terminated Components and Vias
Should the thermal vias of bottom terminated components be tented on both sides to prevent flux trapping and ...
N.P.

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