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Ask the Experts Index |
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Jul 2, 2026 Class 3 Cleaning Requirements We recently received our first contract to assemble Class 3 circuit board assemblies. Are there any changes we ... L.L. Jul 1, 2026 Mixing Different SAC305 Solders We have been using SAC305 bar solder from one supplier. We now want to source it from a ... M.K. Jun 30, 2026 Rework of Underfilled Array Packages What is the best method for removing a SMT array package that has been underfilled and cured? Mechanically, ... E.C. Jun 29, 2026 What Causes Solder Balls During Rework? During the rework of SMT components on conformal coated boards, we see solder balls appearing at neighboring components. ... T.W. Jun 26, 2026 Advise and suggestions for assembly using 01005 capacitors. I have just been asked to quote a project with assemblies which include 01005 capacitors. We have never ... R.P Jun 25, 2026 Selective Printing for BGA Components We use common BGA packages on many of our low-end products. To save cost, could we print paste ... A.J. Jun 24, 2026 PCBA Transport Between Facilities We need to transport PCB assemblies between separate facilities for testing and added processing. The facilities are approx ... R.C. Jun 23, 2026 SOT (Small Outline Transistor) Body Cracks We have been facing an issue with SOT body cracks in our PCBA assembly line. What could be ... R.K. Jun 22, 2026 Shielding Techniques When Removing Components Using Hot Air When removing a component using hot air near heat-sensitive parts, what shielding techniques are most effective? ... K.S. Jun 19, 2026 Partially Visible or Hidden Solder Connections This issue relates to IPC J-STD-001 section 4.18.3 - Partially Visible or Hidden Solder Connections. The issue primarily ... M.S. |
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