|Ask the Experts Index|
Apr 12, 2021
Viscosity of Solder Paste Before Printing
What is the general recommended viscosity of solder paste before printing. ...
Apr 9, 2021
Bottom Terminated Components and Vias
Should the thermal vias of bottom terminated components be tented on both sides to prevent flux trapping and ...
Apr 8, 2021
Is Solder Mask Considered an Insulator
If solder from a PTH lead, on the source side, touches solder mask that is over a copper ...
Apr 7, 2021
Reduce Glare During Assembly
We have a problem with excessive glare during hand assembly operations, particularly when placing components by hand, and ...
Apr 6, 2021
BGA BAll Sheer Testing
We soldered a lead-free 548-ball BGA. Afterreflow, we mechanically pulled the BGA component off the circuit board surface.See ...
Apr 5, 2021
Components Jumping Around During Reflow
We reflowed a set of boards using a lead-free solder process and had issues with components jumping around ...
Apr 2, 2021
Floor Life of MSD Parts
We run small jobs so a reel of MSD components could be opened and closed a number of ...
Apr 1, 2021
QFN Open Solder Joints
We are experiencing opens on assembled QFN components at a rate of approx 9%. This component has 2 ...
Mar 31, 2021
Delamination Causing Scrap
We have been experiencing delamination on our printed board assemblies causing scrap. Is there a way to definitively ...
Mar 30, 2021
Adhesion Problems with Conformal Coating
We have a large RF back plane that is gold plated on the operational side. We are having ...
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