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Ask the Experts Index |
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May 5, 2026 Bottom Terminated Components and Vias Should the thermal vias of bottom terminated components be tented on both sides to prevent flux trapping and ... N.P. May 4, 2026 Cleanliness Standards for Electronic Components I work as a supplier engineer in our automotive division and we are very concerned about cleanliness for ... D.D. May 1, 2026 Baking Concerns for Stacked Trays of Components When we are baking multiple trays of parts stacked on top of each other in our oven, will ... T.G. Apr 30, 2026 Cleanliness Requirement for Populated Printed Boards Has anyone performed a Cleanliness Requirement for populated Printed Boards per VDA 19.1. A customer is requesting that ... W.H. Apr 29, 2026 Flux Residue During Pin-in-Paste Our application is for pin-in-paste reflow using tin/lead no-clean, solder paste. Is it standard practice to increase the ... M.W. Apr 28, 2026 Storage To Prevent Corrosion Which storage method will better protect against corrosion, nitrogen or super-dry? ... L.M. Apr 27, 2026 Manual or Automated Assembly? We are a new start-up assembling wireless sensors. All assembly is now manual, we have no automation. We ... R.M. Apr 24, 2026 Soldering Station Calibration To calibrate or not, that is the question. When our company purchased new soldering stations two years ago ... A.A. Apr 23, 2026 Exposed Copper Risk We received many PCB's where a modification have been completed. The modification involved soldering a chip cap to ... A.H. Apr 22, 2026 Baking Old PCBs Prior To Reflow Our standard procedure for new bare PCBs is to bake at 125C if the date code is greater ... J.M. |
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