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872 expert questions.

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Jul 19, 2024
Confused About IPC-A-610 Class 2 vs. Class 3
My company is confused about IPC-A-610 Class 2 and Class 3. Some believe that Class 3 is for ...
T.G.

Jul 18, 2024
Mixed MSL Baking
If the highest MSL-rated component on a PCB had a 27-hour bake time at 125C (1.4-2.0mm, MSL 3) ...
B.B.

Jul 17, 2024
BGA Component Grounding Problem
We have an ongoing concern regarding reliability BGA components. Over the last year, we had boards returned due ...
M.S.

Jul 16, 2024
Need for Reflow Profiles
How important is it to run a profile on every different assembly? I have been told choosing an ...
E. R.

Jul 15, 2024
Gold Plating and Embrittlement
What is your opinion regarding gold plating removal to improve soldering? I believe in the past gold plating ...
M.B.

Jul 12, 2024
Test Probe Problems After Pin-In-Paste
We are having test probe contact issues with our Pin-In-Paste process. The root cause being the flux residue ...
S.S.

Jul 11, 2024
Environment Impact on Assembly, Printing and Reflow
At our SMT facility we currently control ambient temperature (20-30 C), relative humidity (40-60%) and particle count (0.5 ...
J.P.

Jul 10, 2024
Head-In-Pillow Reject Rate
We have rejects that look like head-in-pillow. We see rejects in 2 or 3 per 15,000 PCBs. Should ...
A.B.

Jul 9, 2024
What is the IPC Definition of Uncommonly Harsh?
IPC-A-610 and other documents define class 3 to include products where "the end use environment may be uncommonly ...
S.M.

Jul 8, 2024
Average Temperature/Humidity for an Electronics Assembly Facility?
I'm the Production Manager for a contract manufacturer. We do mostly thru-hole circuit boards and limited SMT with ...
S.H.

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