Ask the Experts Index
PRIOR
  Page 1 of 86  
NEXT
INDEX
ASK
PANEL
JOIN
Nov 24, 2021
Removal of Non-functional Pads from Inner Layers
Should we remove non-functional pads from inner layers. In some cases, it may be necessary to free up ...
S.S.

Nov 23, 2021
Reliability of Automated Soldering vs. Hand Soldering
On occasion, we have had to place a skip in our SMT placement machine due to unavailability of ...
P.K.

Nov 22, 2021
Profiling for Double Sided BGA
We are about to produce double sided BGA boards - BGA components on both sides. What advice would ...
B.O.

Nov 19, 2021
BGA Joint Voids - Accept or Reject?
Per IPC-610 acceptability standards, would you accept or reject this BGA solder joint? Is this level of voids ...
E.W.

Nov 18, 2021
A Generic Reflow Profile
We have a wide mix of PCB assembly types. Some folks here are proposing that we use the ...
G.S.

Nov 17, 2021
Overlap Solder Joint Failures
What is the strongest way to connect two 8mm flexible LED strips together? We now lap solder one ...
J.M.

Nov 16, 2021
Solder Balling Prediction Formula
We have experienced mid chip solder balling on some passives. Is there a mathematical calculation that can be ...
R.W.

Nov 15, 2021
Critical Part Fixture During Reflow
I'm populating a PCA with a component that has critical placement requirements. My pick/place machine does not have ...
R.W.

Nov 12, 2021
How to Re-qualify BGA Spheres
What procedure would you recommend to "re-qualify" a lot of BGA spheres. We keep our spheres in a ...
J.D.

Nov 11, 2021
How To Measure Solder Paste Rolling Diameter
A customer has asked us to measure the rolling diameter of solder paste while printing with our automated ...
S.K.

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address