|
|
|
|
|
|
|
|
|
|
|
|
| Ask the Experts Index | |||||||||
|
|||||||||
|
|
|||||||||
|
Oct 3, 2023 How To Reduce Solder Joint Voids in QFN Components What techniques and methods can we use regarding our solder paste stencil design to reduce or eliminate solder ... H.C. Oct 2, 2023 Question About PPM Defect Rate for Reversed Packages Which process/equipment has the higher ppm defect rate for reversed packages: SMT pick-and-place or component taping-and-reeling? I have ... A.D. Sep 29, 2023 Solder Paste Life on the Stencil Our solder paste has a specified life for exposure on the stencil at 10 hours. We run our ... S.S. Sep 28, 2023 Jumper Wire Gauge Is there a recommended gauge and insulation type for standard circuit board jumper wires? Is there a suggested ... G.S. Sep 27, 2023 Wet Based Stencil Cleaning or Dry Wipe Stencil Cleaning For automatic under-stencil cleaning there are many cleaning methods including dry vacuum cleaning, and wet dry vacuum cleaning. ... S.A Sep 26, 2023 Suggested Limit for PCBA Heat Cycles What is the suggested limit for the total number heating cycles that can be done on one PCB ... P.V. Sep 25, 2023 Rise of Bismuth Levels in our Solder Pots We have an issue of concentrating bismuth in our selective solder machines. We have two machine and both ... J.G. Sep 22, 2023 Options for Reballing BGA Components Which of the following do you recommend when reballing BGA components? Reballing with solder paste and solder spheres, ... J.J. Sep 21, 2023 BGA Component Cleaning Spec Is there a standard or or specification covering requirements for BGA cleaning after rework? ... E.C. Sep 20, 2023 Solder Mask Thickness Tolerance Our standard PCB fabrication drawing indicates solder mask of 0.8mil thickness. If this is an acceptable standard note, ... J.L. |
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Insert Your Email Address |
|
|
|
|
|
|
|
|