|
|
|
Ask the Experts Index |
|||||||||
|
|||||||||
|
|
|||||||||
|
Apr 19, 2030 Manual or Automated Assembly? We are a new start-up assembling wireless sensors. All assembly is now manual, we have no automation. We ... R.M. May 19, 2025 Inspection for Hidden Solder Joints We are integrators working on automating the assembly for a high-volume medical device that requires multiple boards to ... B.S. May 16, 2025 Flux Residue During Pin-in-Paste Our application is for pin-in-paste reflow using tin/lead no-clean, solder paste. Is it standard practice to increase the ... M.W. May 15, 2025 Soldering Station Calibration To calibrate or not, that is the question. When our company purchased new soldering stations two years ago ... A.A. May 14, 2025 Design Considerations and Impact on Assembly What are the most common design decisions that can have a negative impact on the PCB assembly and ... G.B. May 13, 2025 What Causes Component Rotation During Reflow? We are using a large 2 pin SMT inductor. During reflow soldering it rotates almost 30 degree. We ... S.S. May 12, 2025 Through Hole Connector Solder Joint Hole Fill When looking at IPC610D in relation to through hole connectors and Class III level soldering. What is the ... R.D. May 9, 2025 How To Remove Oxidation On SMT Components What process do you recommend for removing oxidation from SMT components? These components are unsolderable due to the ... R.J. May 8, 2025 Stencil Cleaning Procedure Currently, as needed, our EMS contractor wipes the bottom side (board contact side) of each solder paste stencil ... P.M. May 7, 2025 Bottom Terminated Components and Vias Should the thermal vias of bottom terminated components be tented on both sides to prevent flux trapping and ... N.P. |
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Insert Your Email Address |
|
|