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Ask the Experts Index

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876 expert questions.

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May 12, 2025
Through Hole Connector Solder Joint Hole Fill
When looking at IPC610D in relation to through hole connectors and Class III level soldering. What is the ...
R.D.

May 9, 2025
How To Remove Oxidation On SMT Components
What process do you recommend for removing oxidation from SMT components? These components are unsolderable due to the ...
R.J.

May 8, 2025
Stencil Cleaning Procedure
Currently, as needed, our EMS contractor wipes the bottom side (board contact side) of each solder paste stencil ...
P.M.

May 7, 2025
Bottom Terminated Components and Vias
Should the thermal vias of bottom terminated components be tented on both sides to prevent flux trapping and ...
N.P.

May 6, 2025
Hand Soldering at Low Temperature
We often need to make repairs in the field involving circuit board soldering. Is there any impact on ...
P.S.

May 5, 2025
Low Operating Temperature Lead-Free Solder
We will be soldering copper wires inside a motor that operates in a cold environment at -200 °C ...
L/M.

May 2, 2025
Mixed Process Solder Joint Appearance, Smooth or Grainy?
We are using RoHS components that are placed using tin/lead solder paste and soldered in oven using a ...
P.W.

May 1, 2025
ESD Grounding - 1 Meg Ohm Resistor
Why do we need to use a 1 meg-ohm resistor for ESD grounding? ...
R.R.

Apr 30, 2025
Stencil Pattern for LGA Power Pad
We are experiencing difficulties reliably soldering the large ground pad on land grid array (LGA) packages using a ...
J.M.

Apr 29, 2025
BGA Die and Pry Testing
See the image of a die and pry flip chip BGA. Are these results Kirkendall Voiding or some ...
J.J.

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