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Low Thermal Resistance Epoxy
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Ask the Experts Index

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886 expert questions.

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May 26, 2026
Solder Ball Wrinkles
Why do wrinkles form on the surface of solder balls during reflow? This device uses Pb37Sn63 solder balls. ...
L.L.

May 22, 2026
Assembly Question for Soldering USB Connectors
We need to assemble approximately 50,000 straddle USB connectors per year. What is the best way of mounting ...
P.B.

May 21, 2026
BGA Die and Pry Testing
See the image of a die and pry flip chip BGA. Are these results Kirkendall Voiding or some ...
J.J.

May 20, 2026
Rise of Bismuth Levels in our Solder Pots
We have an issue of concentrating bismuth in our selective solder machines. We have two machine and both ...
J.G.

May 15, 2026
Inspection for Hidden Solder Joints
We are integrators working on automating the assembly for a high-volume medical device that requires multiple boards to ...
B.S.

May 14, 2026
Solution for Warped PCBAs
From a large lot we have 20 populated boards with components on both sides that are warped. Components ...
E.J.

May 13, 2026
BGA Component Cleaning Spec
Is there a standard or or specification covering requirements for BGA cleaning after rework? ...
E.C.

May 12, 2026
Tin Whiskers and Vapor Phase Reflow
Can we solder components with tin-plated leads using Sn63Pb37 solder paste in vapor phase reflow (215C) without a ...
M.B

May 11, 2026
Soldering Station Calibration
To calibrate or not, that is the question. When our company purchased new soldering stations two years ago ...
A.A.

May 8, 2026
Solder Paste Stencil Inactivity
How long can we leave solder paste on a stencil without any activity, wiping, etc.? ...
S.K.

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Manncorp

Catch Defects Before They Cost You
3D AOI analyzes true solder height, contour, and volume to expose defects 2D systems miss—reducing false calls, rework, and escapes on ultra-compact components.
Manncorp Inc.
Glenbrook-Technologies