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Ask the Experts Index

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877 expert questions.

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Oct 23, 2025
Toe Fillet Requirements on Gull Wing Components
Is a toe fillet required on gull wing components? If it is not a requirement why is that ...
A.C.

Oct 22, 2025
Selective Soldering Frame Causing Cold Solder Joints
We have continual problems with our wave soldering system, especially cold solder joints. Could the cold solder joints ...
T.H.

Oct 21, 2025
Seeking IPC and J-STD Definitions
What is the definition of a body seal on a component? What is the definition of a lead ...
C.B.

Oct 20, 2025
Step Stencil Squeegee Angle
If you have step stencil, what angle should we use for the squeegee when printing solder paste, and ...
P.P.

Oct 17, 2025
Dross Particles Sticking to PCBs
We are wave soldering using 63/37 tin-lead solder. After wave, we are finding solder dross particles sticking the ...
K.U

Oct 16, 2025
Rework or Repair?
We often need to strip solder splash contamination off gold edge contacts and replate them. Is this considered ...
B. N.

Oct 15, 2025
BGA Component Grounding Problem
We have an ongoing concern regarding reliability BGA components. Over the last year, we had boards returned due ...
M.S.

Oct 14, 2025
Aluminum Trays and Rapid Static Discharge
Occasionally we transport assembled circuit boards directly on aluminum trays. Some in our plant are concerned that the ...
W.M.

Oct 13, 2025
Use of Nitrogen for Hand Soldering
Is there any reasonable way to hand solder without flux to totally eliminate cleaning? Is there such a ...
S. R.

Oct 10, 2025
Environment Impact on Assembly, Printing and Reflow
At our SMT facility we currently control ambient temperature (20-30 C), relative humidity (40-60%) and particle count (0.5 ...
J.P.

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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ÂșC
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