Ask the Experts Index
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Sep 16, 2021
Options for Reballing BGA Components
Which of the following do you recommend when reballing BGA components? Reballing with solder paste and solder spheres, ...

Sep 15, 2021
Solder Paste Viscosity
Is it permissible to return a sample of paste to the original solder paste container after the sample ...
L. W.

Sep 14, 2021
MSD Components Baked Too Long
If MSD components are baked for more time than specified in J Std, can this cause potential failures ...

Sep 13, 2021
Aluminum Trays and Rapid Static Discharge
Occasionally we transport assembled circuit boards directly on aluminum trays. Some in our plant are concerned that the ...

Sep 10, 2021
Seeking IPC and J-STD Definitions
What is the definition of a body seal on a component? What is the definition of a lead ...

Sep 9, 2021
Is Component Lead Damage Reparable?
Our lead forming process left gashes in the component leads. Some more than 10% of the lead thickness, ...

Sep 8, 2021
BGA Solder Ball Shelf Life
I believe BGA Solder Balls are a homogeneous mass of metals, why is the shelf life only two ...

Sep 7, 2021
Conformal Coating Press Fit Connectors
We are having problems withpress-fit connectors. We produce military circuit board assemblies andcurrently use a fast drying, single ...

Sep 3, 2021
Solder Paste Past Shelf Life
We have some solder paste that has been in a sealed box at 4degree Celsius for more than ...

Sep 2, 2021
How To Reduce Solder Joint Voids in QFN Components
What techniques and methods can we use regarding our solder paste stencil design to reduce or eliminate solder ...

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