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Ask the Experts Index |
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Mar 25, 2026 3D AOI Solder Joint Qualification Parameters We have a new inline 3D AOI system. One of the options on our system allows checking if ... J.S. Mar 24, 2026 Solder Contamination Sources What are the most common sources of lead-free solder bath contamination? ... S.S. Mar 20, 2026 Removal of Non-functional Pads from Inner Layers Should we remove non-functional pads from inner layers. In some cases, it may be necessary to free up ... S.S. Mar 19, 2026 Components Jumping Around During Reflow We reflowed a set of boards using a lead-free solder process and had issues with components jumping around ... M.D. Mar 18, 2026 Estimating Failure Rate During Rework Is there a way to estimate the potential failure rate introduced by hand rework of one SMT part. ... A.F. Mar 17, 2026 Long Term Component Storage We need to store a variety of electronic SMD components for at least 10 years. What do you ... R.A. Mar 13, 2026 How To Measure Solder Paste Rolling Diameter A customer has asked us to measure the rolling diameter of solder paste while printing with our automated ... S.K. Mar 12, 2026 Class 3 Pin Contact Question I am working on a class 3 product. We have an assembly from one operation that has a ... E.E. Mar 11, 2026 Solder Paste Print Test Boards We're looking for a better way to manage solder-paste print test boards. Can we use a general test ... W.H. Mar 10, 2026 Removing Cleaning Residues Under BTC Packages How do you determine whether cleaning residues under BTC (Bottom Terminated Component) packages have been sufficiently removed in ... C.G. |
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