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Sep 21, 2020 Problems With Large Voids I work at a very fast paced quick turn prototype house. Recently we had large voids on a ... B.H. Sep 18, 2020 Stainless Steel Benches and ESD I do some contract work for a company that uses stainless steel benches in both their assembly area ... T.S. Sep 17, 2020 Exposed Copper Defect Is exposed copper considered a class 3 defect per IPC-610 or J-STD documents? ... J.U. Sep 16, 2020 What's Causing Cloudy Conformal Coating We are experiencing electrical faults with an assembly. When the units are inspected we see an abnormal cloudy/milky ... F.G. Sep 15, 2020 Channels To Reduce Voids in Large Pads At our facility we have devices with large pads (D2PAK for example) that have had voids visible through ... A.U. Sep 14, 2020 Options for Reballing BGA Components Which of the following do you recommend when reballing BGA components? Reballing with solder paste and solder spheres, ... J.J. Sep 11, 2020 Aluminum Trays and Rapid Static Discharge Occasionally we transport assembled circuit boards directly on aluminum trays. Some in our plant are concerned that the ... W.M. Sep 10, 2020 BGA Solder Ball Shelf Life I believe BGA Solder Balls are a homogeneous mass of metals, why is the shelf life only two ... V.P. Sep 9, 2020 Tarnished OSP Circuit Boards We are purchasing circuit boards from China and they are coming in with a tarnished looking finish (they ... W.B. Sep 8, 2020 Stencil Pattern for Thermal Pads on QFNs We need more information regarding the stencil pattern for thermal pads on QFNs. We know why it is ... C.P. |
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