|
|
|
Ask the Experts Index |
|||||||||
|
|||||||||
|
|
|||||||||
|
Feb 11, 2026 Overlap Solder Joint Failures What is the strongest way to connect two 8mm flexible LED strips together? We now lap solder one ... J.M. Feb 10, 2026 How to Re-qualify BGA Spheres What procedure would you recommend to "re-qualify" a lot of BGA spheres. We keep our spheres in a ... J.D. Feb 9, 2026 Pick and Place Machine Calibration In general how often should we calibrate pick and place machines, or run a placement machine process capability ... B.O. Feb 6, 2026 Components Falling Off During Reflow Can excessive solder paste volume contribute to components falling off the bottom of the circuit board during topside ... L.W. Feb 5, 2026 Solder Balling Prediction Formula We have experienced mid chip solder balling on some passives. Is there a mathematical calculation that can be ... R.W. Feb 4, 2026 Dendritic Growth and Contamination at BGA Sites We have 180 assemblies where our subcontractor replaced five BGA memory devices. Unfortunately they utilized active flux and ... R.D. Feb 3, 2026 Removal of Coatings from PCBs What the best way to remove coatings from assembled PCBs. Can you point me to some type of ... C.M. Feb 2, 2026 LED Component Shift During Reflow What can be the root cause of SMT LED Component Shift during reflow? See the photo. ... M.M. Jan 30, 2026 Initial Screen Print Test Board Is it recommended to print one cycle before printing the first production board? I could use a scrap ... S.G. Jan 29, 2026 Depaneling circuit board that contain BGA components Are there any special requirements for depaneling or V-scoring to separate paneled circuit board if they contain BGA ... A.A. |
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Insert Your Email Address |
|
|