|Ask the Experts Index|
Sep 21, 2020
Problems With Large Voids
I work at a very fast paced quick turn prototype house. Recently we had large voids on a ...
Sep 18, 2020
Stainless Steel Benches and ESD
I do some contract work for a company that uses stainless steel benches in both their assembly area ...
Sep 17, 2020
Exposed Copper Defect
Is exposed copper considered a class 3 defect per IPC-610 or J-STD documents? ...
Sep 16, 2020
What's Causing Cloudy Conformal Coating
We are experiencing electrical faults with an assembly. When the units are inspected we see an abnormal cloudy/milky ...
Sep 15, 2020
Channels To Reduce Voids in Large Pads
At our facility we have devices with large pads (D2PAK for example) that have had voids visible through ...
Sep 14, 2020
Options for Reballing BGA Components
Which of the following do you recommend when reballing BGA components? Reballing with solder paste and solder spheres, ...
Sep 11, 2020
Aluminum Trays and Rapid Static Discharge
Occasionally we transport assembled circuit boards directly on aluminum trays. Some in our plant are concerned that the ...
Sep 10, 2020
BGA Solder Ball Shelf Life
I believe BGA Solder Balls are a homogeneous mass of metals, why is the shelf life only two ...
Sep 9, 2020
Tarnished OSP Circuit Boards
We are purchasing circuit boards from China and they are coming in with a tarnished looking finish (they ...
Sep 8, 2020
Stencil Pattern for Thermal Pads on QFNs
We need more information regarding the stencil pattern for thermal pads on QFNs. We know why it is ...
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