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Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.
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Viewpoint Index |
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PRIOR
Page 1 of 88
NEXT
INDEX
704 viewpoint listings.
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Feb 9, 2026
VIEWPOINT 2026: John VanNewkirk, CEO, CheckSum
As we head into 2026, electronics manufacturers face a tightening vise: customers expect more value, yet costs continue to rise. Tariffs remain unpredictable, global transport costs have not returned to pre-pandemic levels, and skilled labor is increasingly scarce and expensive. At the same time, product complexity ...
Feb 6, 2026
VIEWPOINT 2026: Greg Norton, COO, ProEx
As the electronics industry enters 2026, speed, flexibility, and execution will continue to differentiate trusted partners from transactional providers. Product complexity continues to rise, supply chains remain fluid, and expectations for responsiveness have never been higher.
Feb 5, 2026
VIEWPOINT 2026: Przemysław Prolejko, CEO, Assel Electronics Manufacturing Services
The business outlook for 2026 is positive. This is supported with a healthy order book on hand, as well as several projects in the introduction phase. As an Electronics Manufacturing Services (EMS) provider located in Europe (Poland), we observe that the industrial markets are slowly rebounding, and on top of that we see ...
Feb 4, 2026
VIEWPOINT 2026: Doug Dixon, CEO, 360 BC Group Inc.
As we move into 2026, higher power density, and HDI designs are tightening thermal and reliability margins across electronic systems. Rising junction temperatures and finer features are pushing current materials to their limits, increasing the need for higher-performance TIMs, metalized IMS substrates, and advanced ...
Feb 3, 2026
VIEWPOINT 2026: Greg DeLarge, President, Plasma Etch, Inc.
As we conclude another strong year, we are proud of the progress and innovation enjoyed by our organization and our customers. The performance and reliability of our plasma systems continue to be demonstrated across a wide range of applications from the circuit board industry to aerospace. We remain ...
Feb 2, 2026
VIEWPOINT 2026: Pierre-Jean Cancalon, Head of Marketing and Communication, Essemtec
Looking ahead to 2026, Essemtec enters the year with strong momentum and a clear global vision. The successful launches in 2025 — including the FOX Ultra and PUMA Ultra platforms, record-breaking high-speed solder paste jetting reaching up to 1.1 million dots per hour, and the introduction of the Tarantula ...
Jan 30, 2026
VIEWPOINT 2026: Barbara Duvall, General Manager, Seica s.p.A.
2025 has been a classic example of a "keep calm and carry on" kind of year amid the chaos of geo-political storms, the confusion and uncertainty regarding tariffs and major industrial shifts, particularly in the automotive sector. All of these factors have driven the focus of our business plans toward increasing our sales ...
Jan 29, 2026
VIEWPOINT 2026: Tom Tattersall, Chief Executive Officer, MicroCare
As we look toward 2026, MicroCare is positioned for an exciting year of innovation, growth, and more advanced solutions for our customers. We plan to expand our portfolio with several new cleaning formulations and process-enhancing technologies designed to deliver higher efficiency, improved safety ...
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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
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