| Sponsor |
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Best alternative to dispensed adhesives
PLACE-N-BOND underfilm eliminates dispensing and curing in SMT assembly. Use PLACE-N-BOND for solder joint strain relief, shock/drop reliability improvement & encapsulation. Read more.
Alltemated Inc.
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Viewpoint Index |
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PRIOR
Page 1 of 91
NEXT
INDEX
725 viewpoint listings.
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Mar 10, 2026
VIEWPOINT 2026: Michael Sivigny, General Manager, CeTaQ Americas
As we look toward 2026, CeTaQ Americas remains committed to our core conviction: "If you don't measure, you don't know." With the continued push for reshoring and domestic manufacturing—driven in part by the evolving tariff landscape—the need for localized, hyper-efficient production is paramount. Our outlook for 2026 ...
Mar 9, 2026
VIEWPOINT 2026: Lukas Buske, CEO, Plasmatreat GmbH
At the 2025 productronica and SEMICON Europa events, we presented our comprehensive electronics manufacturing product portfolio, which covers the entire process chain — from wafer cleaning and PCB assembly to surface pretreatment prior to conformal coating. A notable product is the REDOX®-Tool, ...
Mar 6, 2026
VIEWPOINT 2026: Mike Buetow, President, Printed Circuit Engineering Association
Workforce development and training are taking center stage among the discussions and priorities in electronics manufacturing and – at long last – in academic settings as well. While colleges and industry have long pointed fingers over whose responsibility it is to prepare the next generation for job readiness, the two ...
Mar 5, 2026
VIEWPOINT 2026: John Singer, Chief Operations and Engineering Officer, Qnity
The global semiconductor industry is entering a new era of expansion – driven largely by growth in AI. In 2025, Qnity launched as an independent company, and we've quickly made our mark. It's no secret that at Qnity we believe our materials are essential in powering the next leap. We also believe that tomorrow's ...
Mar 4, 2026
VIEWPOINT 2026: Rich DePoto, Business Development Manager, Uyemura
Uyemura has invested ambitiously in advanced chemical technologies. As such, we can find ourselves with extraordinary solutions . . . in search of problems. When adaptation advances slowly, this approach can appear inefficient – at least temporarily. Today's electrical design needs are clearly outpacing what's ...
Mar 3, 2026
VIEWPOINT 2026: Ross Berntson, President and CEO, Indium Corporation
Innovation is at the core of our culture and our portfolio of advanced solder materials. In 2026, we will continue expanding our product offerings to solve challenges our customers face—driven by demands in areas like AI, 5G/6G, and sustainability—while further advancing our Durafuse® line of mixed alloys for high-reliability ...
Mar 2, 2026
VIEWPOINT 2026: Jesper Lykke, CEO, Viscom Inc.
In 2026, Viscom continued progress fueled by innovation, improving market conditions, and a strong project pipeline. A key milestone will be the launch of vAI Provision, a new software solution that underscores Viscom's expanding use of artificial intelligence to enhance our portfolio and deliver increased value ...
Feb 27, 2026
VIEWPOINT 2026: Yassir Djebli, Sales and Support Engineer, DEN-ON INSTRUMENTS CO.,LTD
In 2026, we will be launching two important technology advancements. The first is a new member of our RD-500V rework soldering system family, designed to make alignment easier and more precise than ever before. Instead of manually aligning SMD components, alignment is now Automatic , with all axes motorized. ...
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Precision Control for BGA Rework
Vacuum sensing electronics provide control for gentle, automatic component removal while a non-contact site cleaning tip's height is accurately monitored and maintained.
Air-Vac Engineering
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