Foad Ghalili, President/CEO, Epoch International Enterprises, Inc.

Advanced Thermal Solutions, Inc, or ATS, has been cooling electronics for 36 years. As our name says, we keep pace with the thermal management needs of faster-running, higher-powered components and systems.

Today, AI dominates the headlines, not only in technology but in almost every industry. The investments and the expectations are high. So, meeting AI's demanding cooling needs is a major focus. From chip, to PCB, to racks and systems, high-powered AI components need reliable, effective cooling. Failure is not an option.

While construction grows on colossal AI data centers, AI components are being integrated into factories, labs, hospitals, military bases, and other areas, as part of the IoT or in autonomous installs. Cooling systems here are even more relied upon, with less available monitoring and maintenance.

Powerful liquid cooling is needed at most AI design levels. Self-contained CDUs (cooling distribution units) offer intelligent control and high reliability from factory floors to ORs to lab benchtops. And for megawatt datacenters, massive (>3MW) cooling power CDUs provide high flow liquid cooling for demanding thermal loads.