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| Industry Paper Index |
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Aug 18, 2026 UHDI Fabrication for IC Substrates: SAP and mSAP Processes Approach described includes adhesion promotion, direct plating, electroless copper, blind-via filling, trench filling, and solder-resist metallization technologies. Precise control of surface preparation, activation, and copper thickness uniformity improves via coverage and interconnection without excessive roughening. Uyemura International Corporation Jun 30, 2026 Flux-Free, Reliable, Efficient: Soldering with Formic Acid Whitepaper shows formic-acid-assisted, flux-free soldering enables reliable, nearly void-free joints for power semiconductors. The technology improves thermal performance and lifespan, offering strong potential for electromobility, renewable energy, and high-frequency electronics. Rehm Thermal Systems GmbH Jun 22, 2026 Redesigning Material Logistics for High-Mix EMS Production High mix electronics manufacturing requires reliable material management. This white paper explains how BMK enhanced traceability, inventory accuracy and picking efficiency using integrated automated storage, digital workflows and reel-level visibility. Essegi Automation S.r.l. Jun 15, 2026 Unlocking Academic-Industry Synergy: A Collaborative Model for Hands-On Electronics Manufacturing Education KYZEN Corporation and the Rochester Institute of Technology (RIT) have established an academic-industry collaboration to integrate real-world electronics manufacturing challenges directly into engineering education. Kyzen Corporation Jun 8, 2026 Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You Viscosity is a useful solder paste quality control measurement, but rheology provides a more complete understanding of how paste will roll, fill, release, recover, and remain stable during stencil printing. AIM Solder Jun 1, 2026 Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste and Ensuring Economic Reuse Component salvaging provides a reliable and consistent method of harvesting electronic components, reducing electronic waste, minimizing fabrication of new components, and ensuring economic reuse for automated assembly. BEST Inc. May 26, 2026 Digital Warehouse Automation in High-Mix PCB Assembly High mix SMT production demands full material visibility. This white paper shows how ASTER improved traceability, inventory accuracy and FIFO control through integrated automation and reel-level tracking across warehouse operations. Essegi Automation S.r.l. May 7, 2026 Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses Intentional contamination of PWBs offers a practical and controlled approach for evaluating cleanliness analysis techniques and for developing meaningful and effective cleanliness guidelines. Kyzen Corporation Mar 11, 2026 Scaling SMT Traceability High-mix electronics manufacturing requires precise material control. This whitepaper explains how Tecnimaster improved traceability, inventory accuracy and picking efficiency through integrated automated storage and reel-level tracking. Essegi Automation S.r.l. Feb 20, 2026 The Drawbacks of Internal Recycling Systems for Solder Dross This paper examines the risks and hidden costs of in-house solder dross recycling, highlighting contamination, compliance, quality, safety, and economic challenges that often outweigh perceived savings. AIM Solder Dec 10, 2025 Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics Electrostatic discharge (ESD) threatens IoT and high-reliability electronics as components shrink and densify. This paper details design protections, assembly controls, and validation methods to help engineers and OEMs enhance device resilience and ensure long-term performance. Contract Production Nov 10, 2025 The Analysis of Variance: Drawing Conclusions from Data That Are Correct, Unambiguous, and Defensible The analysis of variance (ANOVA) allows comparisons between groups using one test. Validation is accomplished by verifying that residuals are normally distributed, have independence of observations, and homogeneity of variances. Uyemura International Corporation Oct 16, 2025 PCB Rework Evolves, With X-ray a Constant Support Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years. Glenbrook Technologies Inc. Aug 20, 2025 How pH Cleaning Agents Affect Production Performance Establishing a reliable cleaning process requires a good understanding of all influencing factors, including pH, and defining the correct balance to meet final product reliability. Kyzen Corporation Aug 6, 2025 A Universal AI-Powered Segmentation Model for PCBA & Semiconductor A universal AI & Deep Learning powered model that enhances defect detection in AOI systems for PCBAs and semiconductors, further improving accuracy, speed and consistency - streamlining inspection processes. CyberOptics Corporation Jul 30, 2025 RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation. Uyemura International Corporation Jul 15, 2025 High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin As electronics are increasingly used in automotive and other high reliability applications, ensuring durability is critical. This paper explores a 'crack-free' flux paste designed to inhibit cracking in harsh environments while meeting stringent surface insulation resistance and ... KOKI Jun 13, 2025 Understanding Solder Dross: Causes and Control Strategies This article outlines the main contributors to dross formation, examines how alloy refining methods play a role, and explores practical ways to reduce dross through process control and equipment optimization. AIM Solder Jun 6, 2025 Optimizing BGA Rework: Challenges, Techniques and Quality Control The complexity of BGA packages introduces challenges during rework requiring innovative methods and inspection practices to ensure performance and reliability. This paper outlines best practices for removing and replacing BGAs. BEST Inc. May 28, 2025 Maintenance: The Basics of Cleaning Series Part 4 This article is the fourth and final part of the series titled "The Basics of Cleaning". In this final chapter, some of the common mistakes in maintenance cleaning applications found in electronic assembly operations will be covered and a summary of the entire series. Kyzen Corporation May 16, 2025 The Economics of Electronic Component Salvage and Reuse This paper explores the feasibility and benefits of salvaging and reconditioning the leads and pads of electronic components, focusing on high-value components such as microprocessors, microcontrollers, and artificial intelligence chips. Circuit Technology Center Inc. May 5, 2025 Cutting Without Contact: How Laser Depanelling Redefines PCB Manufacturing A laser depanelling solution delivers precision, zero mechanical stress, and cleanroom-level quality—transforming PCB manufacturing for high-reliability industries like automotive, medical, and industrial electronics. APAGCoSyst Electronic Control Systems Apr 28, 2025 The "Fried Egg" Effect in Soldering Burnt-on flux residue that is visible on the solder mask of PCBs after improper reflow settings produces significant challenges to the reliability of finished boards. Kyzen Corporation Apr 21, 2025 Flux Technology Development for Solder Paste Compatible with Formic Acid Reflow Ovens for Power Devices This paper introduces a newly developed flux technology compatible with formic acid reduction reflow ovens which offers solutions to the issues associated with conventional power device soldering. KOKI Apr 13, 2025 Innovative Power Module Assembly Solutions Power module production utilizes many different technologies. When industry leaders from these different fields join efforts on the design of these lines, higher efficiency and yields are the result. Infotech Automation Inc. Apr 2, 2025 Unlocking the Potential of Nanoscale Conformal Coatings Revolutionary Plasma Coating as Conformal Coating - discover it now! PlasmaPlus® enables ultra-thin, solvent-free functional coatings under atmospheric pressure - without post-treatment. Ideal for corrosion protection, insulation and adhesion improvement. Plasmatreat GmbH Mar 13, 2025 Recycling vs Circularity: Minimising E-Waste in Manufacturing Electronic waste generation is increasing globally. This paper explores solutions for electronic manufacturers to minimise their contribution, particularly through recycling and circular inventory practices. Component Sense Feb 18, 2025 Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components In this paper we will review how proper cleaning strategies are critical to ensuring long-term reliability in advanced packages and explore how optimized cleaning solutions can help safeguard performance and prevent failure in high-reliability applications. ZESTRON Corporation Jan 28, 2025 Probe Card Manufacturer 'Sees the Unseen' With X-ray Probe card manufacturer relies on mobile real-time x-ray inspection to verify the quality of its precisely aligned probes at different stages along the assembly line. Glenbrook Technologies Inc. Jan 21, 2025 Electronic Assembly Cleaning Basics: Manual Concentration Monitoring Methods Monitoring and effectively controlling chemistry concentration when cleaning electronic assemblies is crucial for maintaining optimal cleanliness results and preventing costly consequences with final products. Kyzen Corporation Dec 18, 2024 An Eight-Step Methodology for Bringing a Process Under Statistical Control More understanding of statistical process control (SPC) is needed to implement best practices in PCB manufacturing. The proper use of SPC enables world-class quality. Uyemura International Corporation Dec 11, 2024 Bismuth in Solder Alloys: From Bulk Constituent in Low Temp to Performance Enhancer in High Rel Bismuth is a primary constituent in many low-temperature solders, but it also serves as an additive element in SAC solders that reinforces joint durability, optimizes wetting characteristics, and minimizes voiding. AIM Solder Nov 27, 2024 Plasma as a Key Technology: Increasing Efficiency and Quality Assurance in the Electronics Industry Plasma technology improves electronics manufacturing, reduces oxide layers without the use of flux, prevents delamination, improves adhesion and enables environmentally friendly, high performance products by using Openair-Plasma® and PlasmaPlus®. Plasmatreat GmbH Nov 20, 2024 Use of Numerical Simulation Methods for the Development of Thermal Systems & Coating Equipment The use of numerical methods in order to support the development of systems and processes has now become widespread. The implementation of these methods helps to minimize development costs by reducing the number of required prototypes thanks to a pre-selection process. Rehm Thermal Systems GmbH Nov 8, 2024 Recent Advances in Final Finishes Push Past the Limits of Conventional Electrolytes In a wide-ranging discussion, Uyemura Business Development Manager Rich DePoto explores DIG, RAIG, EPIG, and the competition-fueled evolution from mSAP to full semi-additive SAP. Uyemura International Corporation Sep 18, 2024 Smart pH Employment in Electronic Cleaning The pH of a cleaning agent affects the entire cleaning process and must be considered when determining the appropriate chemistry and process parameters for success. Kyzen Corporation Aug 13, 2024 Mastering the EV Revolution with Expertise in High-Voltage & E-Mobility With consumers placing a premium on affordability and reliability, companies face a dual challenge and opportunity. We recognize the importance of reliability in consumer acceptance and have honed our knowledge and capabilities in high voltage (HV) ... ZESTRON Corporation Jun 28, 2024 Reflow Oven and Wave Soldering Machine Maintenance Cleaning Maintenance cleaning for reflow ovens and wave soldering machines is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life. Kyzen Corporation Jun 20, 2024 2D SPI and a 2D AOI now integrated in your SMT Production Machine SMT assembly technology offers unmatched flexibility, efficiency, reliability and quality assurance by seamlessly integrating SPI and AOI inspection capabilities into Dispensing and Pick & Place equipment. Essemtec AG May 20, 2024 Solder Paste Printing: Cleaning Compatibility Assessment of Jettable and Screen-Printable Pastes Solder paste jetting is a popular and innovative method for applying solder paste in electronic assembly, especially for modern, 15 miniaturized, and complex electronic assemblies. This technique provides several advantages over traditional solder paste 16 printing methods. ZESTRON Corporation May 14, 2024 An Essential Guide to Optimize Selective Soldering Processing This paper outlines critical parameters including flux selection, thermal aspects, nozzle design and flux residue mitigation to enhance the selective soldering process. Hentec Industries, Inc. / RPS Automation, LLC. Apr 30, 2024 Is My Printed Circuit Board Wash Concentration in Check? Evaluating wash concentration levels through varying testing methods can potentially save process time, reduce overall process costs, and increase cleaning efficacy on PBCs. Read more. Kyzen Corporation Apr 19, 2024 Ultraminiature Soldering: Techniques, Technologies, and Standards We define ultraminiature soldering technology and its applications in today's increasingly compact and sophisticated electronic devices, including the development of industry standards and advanced techniques in setting new benchmarks. AIM Solder Apr 5, 2024 X-Ray Inspection Verifies Quality of Complex PCBs A Netherlands-based PCB supplier with a worldwide customer base relies on real-time X-ray inspection to ensure the quality of its HDI, hybrid, multi-layer, flex-rigid and other complex boards. Glenbrook Technologies Inc. Mar 29, 2024 Cold Underfill Component Removal A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible. Air-Vac Engineering Company, Inc. Jan 25, 2024 Cleaning Performance Evaluations for Jettable Pastes for Advanced SMT Assembly Processes The jetting of solder paste is becoming a popular application method, especially for miniaturizing and other complex electronic assemblies. Solder paste jetting offers several advantages over solder paste printing. ZESTRON Corporation Jan 4, 2024 Dispensing 2-Part Adhesives Two-part mixing valves integrated with software controllers can deliver accurate mix ratios, with volumetric accuracies of +/- 1%, enabling blending hardeners and resins with precise results. Techcon Nov 16, 2023 Advanced Materials in Power Electronics Power electronics play a key role in propelling military vehicles forward, with bidirectional CLLC resonant converters emerging as a transformative innovation. Download here. CoolCAD Electronics LLC Nov 8, 2023 The Impact of Thermocouple Attachment Methods on Thermal Profiling Accuracy Precise measurements are vital to establishing and maintaining the correct thermal profile. This paper reveals the impact of thermocouple attachment methods on thermal profiling accuracy. ECD Nov 1, 2023 Utilizing SIR and Analytical Tools to Determine Impact to Reliability for Process Improvements Implementation of a new process, machine, or material triggers a qualification event for that change under the new H revision of IPC-J-Std-001. ZESTRON Corporation |
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