RF / Microwave Expert PCB Boards
Our wide range of PTFE materials, mixed material stackups, plated cavities, edge plating, high-temp lamination, mode suppression/stitching, buried resistors, and edge launch features. Summit Interconnect
Technical Paper
Optimizing BGA Rework: Challenges, Techniques and Quality Control
The complexity of BGA packages introduces challenges during rework requiring innovative methods and inspection practices to ensure performance and reliability. This paper outlines best practices for removing and replacing BGAs.
BEST Inc.
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
Sponsor
Reclaim Your Factory's Future
Space is a precious resource. With SELECT Synchro, reclaim it, and reimagine your factory's workflow for greater efficiency and scalability. Nordson Electronic Solutions
