| Sponsor |
|
AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
|
|
| Technical Paper |
Optimizing BGA Rework: Challenges, Techniques and Quality Control
The complexity of BGA packages introduces challenges during rework requiring innovative methods and inspection practices to ensure performance and reliability. This paper outlines best practices for removing and replacing BGAs.
BEST Inc.
|
|
|
| More Technical Papers |
Full Technical Paper Index
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
In-House Assembly? We're the Experts
The right equipment, expert installation, technical training, and full support—every step made easy. On-site or remote, we set you up for success.
Manncorp Inc.
|
|
|
