| Industry Paper |
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura International Corporation
|
Complete the form below to download this technical paper.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
|
Sponsor
|
|
Reflow Soldering Oven Survey
We invite you to participate in this important survey about Reflow Soldering Ovens. This survey is anonymous, and your personal data is not collected. Click to begin survey.
Circuitnet Media LLC
|
|
|
