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Industry Paper

High Reliability Lead-Free Solder Paste with Rosin and Anti-Crack Resin

As electronics are increasingly used in automotive and other high reliability applications, ensuring durability is critical. This paper explores a 'crack-free' flux paste designed to inhibit cracking in harsh environments while meeting stringent surface insulation resistance and electro-migration standards set by high reliability product manufacturers.
KOKI
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AIM Solder
Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You
Viscosity is a useful solder paste quality control measurement, but rheology provides a more complete understanding of how paste will roll, fill, release, recover, and remain stable during stencil printing.
AIM Solder