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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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| Technical Paper |
Engineering ESD-Safe PCB Assembly for High-Reliability IoT and Industrial Electronics
Electrostatic discharge (ESD) threatens IoT and high-reliability electronics as components shrink and densify. This paper details design protections, assembly controls, and validation methods to help engineers and OEMs enhance device resilience and ensure long-term performance.
Contract Production
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Bring IPC Training to Your Facility
Mobile training center offers IPC certified classes at your company’s facility making solder training effective and convenient for your entire team.
BEST Inc.
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