AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C Ormet TLPS
Technical Paper
The "Fried Egg" Effect in Soldering
Burnt-on flux residue that is visible on the solder mask of PCBs after improper reflow settings produces significant challenges to the reliability of finished boards.
KYZEN
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
Sponsor
In-House Assembly? We're the Experts
The right equipment, expert installation, technical training, and full support—every step made easy. On-site or remote, we set you up for success. Manncorp Inc.
