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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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Flux Technology Development for Solder Paste Compatible with Formic Acid Reflow Ovens for Power Devices
This paper introduces a newly developed flux technology compatible with formic acid reduction reflow ovens which offers solutions to the issues associated with conventional power device soldering.
Koki Americas
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In-House Assembly? We're the Experts
The right equipment, expert installation, technical training, and full support—every step made easy. On-site or remote, we set you up for success.
Manncorp Inc.
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