Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis. Uyemura
Technical Paper
Flux Technology Development for Solder Paste Compatible with Formic Acid Reflow Ovens for Power Devices
This paper introduces a newly developed flux technology compatible with formic acid reduction reflow ovens which offers solutions to the issues associated with conventional power device soldering.
Koki Americas
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Bring IPC Training to Your Facility
Mobile training center offers IPC certified classes at your company’s facility making solder training effective and convenient for your entire team. BEST Inc.
