Ken Kuang, President and Founder, Torrey Hills Technologies, LLC

At BEST our business outlook for 2026 remains optimistic about the continued growth of our Services, Training, and Products departments. In addition to our BGA reballing, PCB rework and repair, and component salvaging services, we are launching our BGA cold milling service.

Cold milling, or cold component removal, is the precision process of removing an underfilled component from a printed circuit board without applying high heat, preventing heat-related damage and yield loss to the board.

To advance efforts in workforce development our unique Mobile Training Center continues to provide a convenient option for onsite training, helping customers strengthen and expand their workforce with IPC certified courses. Additionally, we have observed steady growth in our Rolling Meadows, Illinois training facility offers IPC certifications for both operator (CIS) and trainer (CIT) courses.

In our products side of our business, we continue to see record demand for our EZReball™ preforms which greatly simplifies the BGA reballing process and eliminates the need for operator dexterity. Our StencilQuik™ and StikNPeel™ rework stencils provide a fast and consistent method for selectively printing solder paste during the rework process eliminating smeared solder paste providing a cleaner alternative to using metal stencils helping customers obtain better yields.