Timothy O'Neill, Director of Product Management, AIM Solder

The Path Forward for Electronics Manufacturing in North America

The Occam Group is bringing its patented, disruptive technology to the electronics industry in 2025. With support from the DOD Executive Agent for PCBs, Occam is building a series of test assemblies to validate its transformative technology, bringing higher reliability and significantly lower costs to the industry.

The problem
For decades, electronic products have been burdened by the limitations and added costs associated with the solder used in component assemblies. In order to build the evermore-sophisticated electronic equipment, the industry has had to compromise quality, reliability and cost in order to continue to use this quite limiting material. As a result, billions of dollars are lost each year in defects, wasted resources and workarounds in order to make solder work within the current system.

The solution
Occam is a manufacturing methodology and enabling technology for assembling electronic components without solder. Occam's solderless approach opens the floodgates to a host of new opportunities. By removing this one limiting piece of the puzzle electronic equipment companies are now free to build the products they’ve always wanted to, without solder's limitations.

Disruptive
It's important to make the distinction that Occam is not simply a new, more efficient process. It is an enabling platform which opens the door to significant opportunities many of which are described in this document. Occam is disruptive. The reader must look beyond a simple process improvement to gain an understanding of the “opportunity” Occam brings to the industry.