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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
February 27, 2025

Heiko Ehrenberg, CEO, GOEPEL Electronics LLC

At ITW EAE, we are actively working on a range of developments to meet the increasing demand for automation and self-optimization solutions from our customers.

Our goal is to advance in these areas swiftly, addressing customer pain points while ensuring the stability and reliability of our solutions before their release. As technology continues to evolve rapidly, ITW EAE is preparing to unveil new innovations in 2025, including patented technologies that will shape the future of manufacturing.

With the exponential growth of electronics in cars, smartphones, and homes, manufacturers are demanding continuous improvements in throughput, yield, and performance. The challenges of miniaturization, along with other technical obstacles, require ongoing advancements in manufacturing equipment. Furthermore, manufacturers are increasingly focused on Industry 4.0, striving for enhanced yield, overall equipment effectiveness, and smart factory capabilities.

Here is a sampling of the innovations we will be presenting in 2025:
• MPM Printers – The MPM Momentum II stencil printer is a proven, highly productive printer platform with industry leading accuracy and repeatability (certified by third party). Enhanced technologies will further improve machine versatility, automation, yield, and ease of use.
• Electrovert Cleaners – We are adding increased performance models to our Aquastorm series cleaners, Aquastorm 160 and Aquastorm 200 Dual Wash. New manifolds have been designed for enhanced cleaning, maintenance, and repeatability features in our Aquastorm 200 series.
• Wave Soldering – Electrovert continues to lead the industry with innovative solutions focused on automation, reducing soldering defects, increasing throughput and solving issues associated with challenging soldering applications.
• Vitronics Soltec Reflow: VS reflow continue to offer differentiating technologies that are designed to excel in demanding production environments.
Heiko Ehrenberg
CEO, GOEPEL Electronics LLC
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling