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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 25, 2025

Rob Boguski, President, Datest Corp.

Assel, as an Electronics Manufacturing Services provider located in Poland, we remain positive as to the outlook for 2025. This is predominantly followed by the continuous global trend of reshoring, as well as the observations that Poland remains an attractive manufacturing hub within Europe.

Furthermore, we expect that industrial markets within Europe will rebound sometime within the middle of 2025. We observe that surplus inventories across the market have already been utilized by majority of the market players and hence we believe that we shall observe a shift within the European industrial markets.

The supply chain turbulences have significantly eased, and no major constraints were observable within 2024. The lead times for electronic components have shortened and the availability remains on a good level. In conclusion as per our observations the material markets have stabilized, and we predict that such status will remain within 2025. Naturally, global tensions remain the biggest risks for stability.

Within 2025 we will continue investment programs aimed at increasing our sustainability levels with the goal to convert into green energy. Another major direction is to further digitalize our internal processes with the goal to automate and integrate administrative activities, as well a series of investments aimed to automate assembly and achieve higher level of repeatability.
Rob Boguski
President, Datest Corp.
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling