circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 27, 2026

Yassir Djebli, Sales and Support Engineer, DEN-ON INSTRUMENTS CO.,LTD

In the wake of last year's global upheaval driven by shifts in U.S. tariff policy, we have been inspired by the remarkable resilience of the global electronics supply chain. Navigating these regulatory changes required significant agility, but as the dust settles, the focus for 2026 is shifting from adaptation to profound innovation—specifically through the maturation of Artificial Intelligence.

At ScanCAD International we anticipate that 2026 will be an incredible year of growth. We are planning significant improvements to our circuit board reverse engineering and inspection processes, driven by a philosophy of human-centric AI.

Rather than seeking to replace the operator, we are implementing AI models specifically designed to enable our employees and augment their expertise. By equipping our team with intelligent tools that handle repetitive tasks, we free them to focus on complex problem-solving and quality assurance. We believe this synthesis of human ingenuity and AI-driven precision is the future of electronics inspection, and we are excited to see the outlook for 2026 unfold.
Yassir Djebli
Sales and Support Engineer, DEN-ON INSTRUMENTS CO.,LTD
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling