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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Rentals and Rent to Purchase x-ray Systems

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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD

Viewpoint

February 17, 2026

Rob Boguski, President, Datest

As AI-driven computing accelerates, Taiwan Union Technology Corporation (TUC) continues to advance our high-performance materials that enable reliable, scalable electronic systems across increasingly demanding applications.

We are expanding beyond our proven ThunderClad4HN platform and accelerating adoption of the ThunderClad5 product family to support higher data rates, tighter impedance control, and compatibility with advanced copper foils and fine-line processing.

Development is also progressing toward next-generation laminate architectures, including designs compatible with HVLP4 copper foil, enhanced resin systems, and advanced stack-ups for AI servers, data centers, high-speed networking, aerospace, and power applications. On the reinforcement side, we continue to expand the use of high-performance glass, including third-generation low-Dk glass and quartz solutions for ultra-low loss and dimensional stability.

Our materials support a diversified mix of end markets spanning HDI platforms, automotive systems, AI infrastructure, LEO satellites, and industrial and power applications. With manufacturing operations in Changshu and Zhongshan in China, Taiwan, and our new Thailand facility, TUC continues to strengthen strategic capacity, regional flexibility, and supply-chain resilience amid evolving trade and tariff conditions.

Entering 2026, TUC remains optimistic, supported by strong demand, a deep development pipeline, and a globally diversified manufacturing footprint.

Rob Boguski
President, Datest

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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura