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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
March 25, 2025

Mike Buetow, President, Printed Circuit Engineering Association

Last year showed considerable improvement of supply chain issues and the production could run in full gear. Even though the problems posed by spreading influence of various international conflicts still weigh heavy on demand and delivery from and to different locations, XIMEA has been able to find new ways to meet the requirements of the customers in plethora of sectors.

The entire field of machine vision and scientific imaging is struggling with the ever growing prices of components, energy, transportation, services, and a continuous shortage of available workforce. Many application areas once deemed promising, such as autonomous vehicles or virtual reality, are entering the mass market more slowly than expected.

While other companies are navigating the current situation by exploring cost reduction or replacing employees with AI, XIMEA is venturing into 3D vision utilizing TOF technology, offering a stronger and larger portfolio of ultra high resolution cameras with up to 245 Mpix, providing a range of options for Ultraviolet wavelength, camera models of smallest industrial USB3 cameras as well as super fast speed cameras.

In 2025, the worldwide situation is even harder to predict, which is why it is important to collaborate with our clients and partners, empowering our colleagues through transparency, efficiency, and innovation.
Mike Buetow
President, Printed Circuit Engineering Association
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling