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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 6, 2026

Nico Federsel, Head of Electronics Sales, Vccount by VisiConsult

The electronics industry is marching towards AI-Data Centers-HDI-faster data processing devices. With signal integrity, reliability and sustainability of electronic assemblies are critically important.

The traditional way of selecting materials for PCB manufacturing has to be reconsidered to keep up with the demand of ever changing electronics requirements.

With respect to final finishes for PCBs, LILOTREE's Ni-free offerings Ni-less ENIG-Premium & OSP-Premium are well equipped to fulfill these requirements- optimal signal integrity, better reliability and eco-friendliness. More importantly, they are cost-effective compared to its legacy counterparts.
Nico Federsel
Head of Electronics Sales, Vccount by VisiConsult
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling