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BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
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January 20, 2026

Chris Williams, Head of European Sales, SolderStar Ltd

Moving Forward Means Delivering Innovation and Adapting to Change

As current technical trends in surface-mount automation align with industry-wide moves towards intelligent factories, 2026 will see Yamaha Robotics unveil important innovations for our 1 STOP SMART SOLUTION and factory software tools.

Yamaha Robotics will continue to invest in new product development. This year, we will introduce frequent upgrades, enhancements, and performance-boosting options in our printers, mounters, inspections systems and software setting the industry reference for performance in all electronic assembly processes.

More than ever, market leadership is achieved through innovation; therefore, we will introduce advanced tools that boost the performance of our customers' businesses, for instance accelerating programming, easing data collection, and automating troubleshooting leveraging the latest techniques including AI. We are seeing demand continue to grow for our flexible and high-performing automation that drives greater manufacturing capabilities, productivity, and quality.

Our state-of-the-art YR series will be equipped with new innovations to deliver class-leading speed and accuracy for surface-mount assembly. We will continue to develop the fully autonomous production line concept we demonstrated in 2025, which integrates smart factory systems, mobile robots, and a prototype mounter. With the entire component journey from warehouse to mounter automated and software controlled, operators will no longer be required to stand in front of machines.

Building stability and resilience is a strategic imperative in today's business climate, hence we will boost our sales and distribution network and strengthen support services for our customers. As a global organisation, Yamaha Robotics is active everywhere including India, one of our main market. Our focus on sustainability will remain a guiding principle as we grow throughout the year to come.
Chris Williams
Head of European Sales, SolderStar Ltd
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
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