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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 16, 2026

Chris Ward, COO, SolderKing Ltd.

Despite the challenges posed by tariffs, Practical Components has effectively managed its impact and maintained strong performance.

The year 2025 was exceptional, and projections for 2026 indicate continued growth and improvement.

We leverage practical AI tools daily to support technical specifications, drawings, measurements, trend analysis, component and PCB research, as well as application development and process optimization.

Looking ahead to 2026, the coming year promises to be even more dynamic and rewarding for our business. With expanding customer demand, advancing technologies, and strengthened global partnerships, we’re positioned to seize new opportunities, deliver greater value, and accelerate innovation across every segment we serve. The momentum ahead is truly inspiring.

For engineers looking towards the future, Practical Components offers a broad selection of wafer-scale components, and our staff possesses the technical expertise to ensure a smooth transition into the next generation of technologies.
Chris Ward
COO, SolderKing Ltd.
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling