circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
March 24, 2025

Michail Klimkovic, CEO, XIMEA s.r.o.

Mek: Driving Innovation and Growth in 2025

2024 was a transformative year for Mek as we expanded into new markets, particularly India, a rapidly growing hub for electronics production. This growth laid the foundation for an exciting 2025, where we plan to release a series of cutting-edge AOI systems, including the highly anticipated 8th-generation desktop inspection technology in Q1. These advancements are tailored to smaller production batches, reinforcing Mek's commitment to innovation.

We are also broadening our lineup of AOI solutions with 3D measurement technology for precise inspection of SMT and THT components and solder joints. Leveraging AI, a domain we've pioneered since 2017, Mek now automates inspection recipe creation by processing data files like ODB++ or Gerber. This breakthrough not only reduces time but eliminates human error, streamlining operations for our clients.

Despite challenges in 2024, including extended shipping times and talent shortages near our US and European headquarters, we've adapted by embracing airfreight and exploring global hiring. With geopolitical stability on the horizon and robust new product releases, 2025 promises to be Mek's strongest year yet. Together, innovation and resilience will propel Mek to new heights, delivering unparalleled value to our global partners.
Michail Klimkovic
CEO, XIMEA s.r.o.
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling