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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
January 23, 2026

John Vickers, A.R.T. Master IPC Trainer, Advanced Rework Technology (A.R.T.)

Entering 2026, momentum across electronics manufacturing in the UK and Ireland remains strong, building on a buoyant second half of 2025. At Altus, activity on the production floor continues to reflect sustained customer investment, particularly as new facilities announced over the past two years begin to move from planning into execution.

Defence and aerospace remain influential drivers, with European and NATO spending still some distance from long-term targets. Alongside this, easing energy pressures and the potential reopening of certain markets are supporting cautious but tangible confidence, even as manufacturers remain mindful of broader geopolitical uncertainty.

Labor availability continues to be a central challenge. An ageing workforce, increased M&A activity within the EMS sector, and the opening of new plants are further stretching an already limited pool of experienced engineers. As a result, manufacturers are placing greater emphasis on process stability, automation and technologies that reduce dependence on operator skill while improving consistency and throughput.

Looking ahead, selective, robotic and vapour phase soldering, conformal coating, laser marking and PCB depanelisation are expected to see particularly strong uptake. At the same time, greater use of data-driven tools and intelligent automation within smart factory environments will continue to shape investment decisions as manufacturers focus on capacity, quality and long-term resilience.
John Vickers
A.R.T. Master IPC Trainer, Advanced Rework Technology (A.R.T.)
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling