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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 28, 2026

Michael Dube, Executive Vice President of Manufacturing Operations, Rochester Electronics

Supporting Customers Through Market Challenges

As we enter 2026, manufacturers continue to face mounting pressures—none more immediate than the rising cost of raw materials. With silver and tin at record highs, the price of common solder alloys like SAC305 has surged. At AIM, our focus remains on helping customers navigate these challenges with proven, practical solutions.

One such solution is REL61, our low-silver alloy developed specifically to address both cost and performance. REL61 contains significantly less silver than SAC305—currently the most expensive component in many lead-free alloys. By optimizing the formulation with a small percentage of bismuth, REL61 not only reduces cost but also improves strength, thermal fatigue resistance, and overall reliability in standard electronics manufacturing environments.

We've also seen how shifting tariff regulations can disrupt production and sourcing strategies. AIM's global manufacturing network, including wholly owned facilities in North America, Asia, Europe, and India, has allowed us to remain flexible and help customers maintain continuity through some challenging trade and tariff situations.

Through changing markets and evolving demands, AIM’s commitment stays constant: help our customers succeed—wherever they are, whatever they're facing.
Michael Dube
Executive Vice President of Manufacturing Operations & Engineering, Rochester Electronics
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling