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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
March 2, 2026

Jesper Lykke, CEO, Viscom Inc.

In 2026, we will be launching two important technology advancements. The first is a new member of our RD-500V rework soldering system family, designed to make alignment easier and more precise than ever before. Instead of manually aligning SMD components, alignment is now Automatic , with all axes motorized. This significantly improves usability, repeatability, and production efficiency.

In addition, we will introduce the UF-100 underfilled components desoldering system. The UF-100 is specifically developed to safely and reliably remove underfilled components, addressing one of the most challenging processes in advanced electronics rework and repair.

Tariffs have affected our business planning , however we are actively working to absorb costs internally so that our customers are not significantly impacted. Artificial Intelligence is a key focus for DEN-ON. We are investing heavily in AI to enable machine teaching, intelligent temperature control, and automated guidance for operators to create optimal one-shot soldering profiles.

Looking ahead to 2026, our strategy centers on machine learning and teaching technologies, allowing our systems to continuously learn and finely tune heat control algorithms for higher-quality, more reliable soldering results.
Jesper Lykke
CEO, Viscom Inc.
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling