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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
March 6, 2026

Mike Buetow, President, Printed Circuit Engineering Association

Building a Stronger Future Together: Powering the Next Leap in Electronics

The global semiconductor industry is entering a new era of expansion – driven largely by growth in AI. In 2025, Qnity launched as an independent company, and we've quickly made our mark.

It's no secret that at Qnity we believe our materials are essential in powering the next leap. We also believe that tomorrow's technologies require collaboration – perhaps more critical now than ever. Let’s dial into one aspect: supply chains.

As we look to the challenges of 2026 and beyond, we know global supply chains are under increasing stress, as highlighted by supply challenges during the pandemic and recent trade dynamics. To succeed, we need supply chains built for resilience.  This means a balanced combination of global reach and local-for-local capabilities. Together, we must invest in ecosystems that support the speed, reliability, and quality our customers require.  

Our approach at Qnity is to prioritize a local-for-local framework, backed up by a global supply network. This requires continuing to build product development, sourcing, and manufacturing close to customers in every region of the world. We also look to strengthen the entire local ecosystem, identifying and qualifying capable partners for raw materials, logistics, and manufacturing.  

The next wave of technological advancement will rely on industry-wide cooperation to enable breakthroughs. Together, we can raise the bar on performance, consistency, quality, and innovation – and power the next leap in electronics.
Mike Buetow
President, Printed Circuit Engineering Association
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling