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Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 9, 2026

John VanNewkirk, CEO, CheckSum

As the electronics industry enters 2026, speed, flexibility, and execution will continue to differentiate trusted partners from transactional providers. Product complexity continues to rise, supply chains remain fluid, and expectations for responsiveness have never been higher.

Leading OEMs and distributors increasingly view outsourced device programming as a strategic extension of their operations. Partnering with specialized providers helps mitigate execution risk, avoid ongoing capital investment, and adjust capacity quickly as product mix and demand change. Just as importantly, outsourcing allows internal teams to remain focused on innovation and growth while relying on proven, compliant processes to protect product integrity.

At ProEx, our focus is delivering reliable, high-quality semiconductor programming and packaging services with the agility to respond as requirements evolve. We continue to invest in advanced programming platforms, automation, and data visibility to support complex devices, compressed schedules, and rigorous traceability standards.

Looking ahead, we are optimistic about 2026 and remain committed to being a responsive, execution-driven partner customers can rely on to adapt quickly, communicate clearly, and deliver consistently from programming through shipment.
John VanNewkirk
CEO, CheckSum
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling