circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
March 3, 2026

Ross Berntson, President and CEO, Indium Corporation

In 2026, Viscom continued progress fueled by innovation, improving market conditions, and a strong project pipeline. A key milestone will be the launch of vAI Provision, a new software solution that underscores Viscom's expanding use of artificial intelligence to enhance our portfolio and deliver increased value to customers. AI is a core element of our product strategy, driving greater efficiency, performance, and differentiation in the marketplace.

While tariffs have presented challenges, overall trends indicate that conditions are improving. These external pressures appear to be easing, enabling customers to plan and invest with greater confidence moving forward.

The business outlook for 2026 is optimistic. Early indicators point to positive momentum, with the first three months of the year expected to be particularly important in validating this trend. Viscom enters the year with a robust list of projects already included in the forecast, reflecting healthy customer demand and strong market engagement.

Overall, the combination of new software launches, increased adoption of AI, a growing project pipeline, and improving market dynamics supports a positive outlook for 2026, with expectations of sustained growth and increased stability throughout the year.

Viscom looks forward to presenting new software and hardware innovations at APEX 2026. Stay tuned.
Ross Berntson
President and CEO, Indium Corporation
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling