circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 3, 2026

Greg DeLarge, President, Plasma Etch, Inc.

Looking ahead to 2026, Essemtec enters the year with strong momentum and a clear global vision. The successful launches in 2025 — including the FOX Ultra and PUMA Ultra platforms, record-breaking high-speed solder paste jetting reaching up to 1.1 million dots per hour, and the introduction of the Tarantula dual-lane solution — have strengthened our technological leadership and reinforced customer confidence across key markets.

Regionally, we expect a particularly strong year in the United States, supported by the gradual restart of investments in electronics manufacturing, ongoing reshoring initiatives, and a growing demand for flexible, high-performance SMT solutions. In Europe, after two softer years, early signs point to a gradual recovery.

While growth is expected to remain measured, customers are once again investing with a focus on efficiency, upgradeability, and long-term sustainability — areas where Essemtec's solutions are well positioned. In Asia, we will continue to expand our footprint, building on recent successes and supporting customers with advanced dispensing and assembly technologies tailored to demanding high-mix production environments.

In 2026, Essemtec will further accelerate innovation with new product launches in both dispensing and pick & place, staying true to our focus: delivering precise, scalable, and future-ready solutions for our customers worldwide.

Our Focus – Your solution
Greg DeLarge
President, Plasma Etch, Inc.
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling