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Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
January 29, 2026

Tom Tattersall, Chief Executive Officer, MicroCare

In 2025, Rochester Electronics continued to scale U.S. manufacturing to meet rising demand for long-life-cycle semiconductor support. As a trusted U.S. partner, we provide turnkey solutions including design, die processing, assembly, packaging, and testing for automotive, industrial, medical, and military markets.

Our demand-based production model enables flexible output, minimizing inventory challenges and ensuring supply stability. We also help customers mitigate global risks, including tariffs and export restrictions, by maintaining all manufacturing and testing onshore.

In 2026, we are investing in complex hybrid package solutions and expanding our die processing, leadframe, leadless package, and lead finishing solutions.

To support this growth, we continue to build a skilled workforce through partnerships with universities and technical schools, backed by investments in facilities, equipment, and training.

Rochester remains the industry's most dependable source for long-term, secure semiconductor solutions.
Tom Tattersall
Chief Executive Officer, MicroCare
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling