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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
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Rentals and Rent to Purchase x-ray Systems
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ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Viewpoint
January 21, 2026

Peer Schumacher, Head of Electronics Manufacturing, Panasonic Connect Europe

Verification of soldering processes is receiving increased attention as manufacturers look to maintain consistent quality and control in everyday production. Rather than relying on assumptions about equipment performance, production teams want clearer visibility of how processes behave under normal operating conditions.

Process stability is shaped by multiple measurable factors. Temperature remains fundamental, but performance is also influenced by controlled oxygen levels, line speed, mechanical stability and the way material is presented and transferred through the process. When these parameters are not routinely visible, gradual changes can go unnoticed until yield or reliability is affected.

SolderStar is seeing growing interest in verification approaches that bring these measurements together, helping manufacturers understand how equipment performs over time and across different lines. This broader view supports preventative maintenance, stronger process control and clearer documentation, without disrupting throughput.

As expectations around quality, traceability and operational efficiency continue to rise, structured multi-parameter verification is becoming an important foundation for reliable soldering operations in 2026.
Peer Schumacher
Head of Electronics Manufacturing, Panasonic Connect Europe
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Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
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Affordable Profiling