Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Rentals and Rent to Purchase x-ray Systems

Sponsor

Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD

Viewpoint

February 28, 2025

Y.F. Michael Kou, Engineer, Accu-Assembly Inc.

We expect 2025 to be a very successful year for GÖPEL electronic. Observing a huge demand for AI-enhanced software capabilities, we are well prepared for the market with our test & inspection equipment. Also, we are launching our new family of inspection systems called MULTI LINE. The core elements of this platform are a modular base system and a uniform and powerful software interface.

For our clients, this commonality across multiple inspection systems reduces training requirements, enables flexible operator scheduling, and optimizes the knowledge transfer between staff members. MULTI LINE can be configured for all optical inspection tasks throughout the entire manufacturing process: for solder paste inspection (SPI), for surface mount technology (SMT) and through-hole technology (THT) automated optical inspection (AOI), and also for conformal coating inspection (CCI).

Y.F. Michael Kou
Engineer, Accu-Assembly Inc.

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura