Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis. Uyemura
Technical Paper
Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components
In this paper we will review how proper cleaning strategies are critical to ensuring long-term reliability in advanced packages and explore how optimized cleaning solutions can help safeguard performance and prevent failure in high-reliability applications.
Zestron Corporation
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Bring IPC Training to Your Facility
Mobile training center offers IPC certified classes at your company’s facility making solder training effective and convenient for your entire team. BEST Inc.
