| Sponsor |
|
Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
|
|
Ask the Experts Member |
|
|
John Sharp
Corporate Product Compliance Manager
TriQuint Semiconductor, Inc.
|
John has focused on Product Compliance and Environmental & Safety issues throughout his career. He has a B.S. in Chemical Engineering, an M.S. in Chemical Oceanography, an M.S. in Environmental Engineering, and is a Professional Engineer in the fields of Chemical and Environmental Engineering.
John Sharp has submitted responses to the following questions.
Bromine Free PWBs
Bromine-free (or more properly known as "Halogen-free" or"Low-Halogen") and Lead-free are not connected. Lead-free requirements are related to the EU ...
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
|
|
|
