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Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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John Sharp

John Sharp

Corporate Product Compliance Manager
TriQuint Semiconductor, Inc.
John has focused on Product Compliance and Environmental & Safety issues throughout his career. He has a B.S. in Chemical Engineering, an M.S. in Chemical Oceanography, an M.S. in Environmental Engineering, and is a Professional Engineer in the fields of Chemical and Environmental Engineering.

John Sharp has submitted responses to the following questions.
Deionized Water Sample Testing
As to the question about DI Water Sampling: It is almost impossible to take an ultra-pure water sample to the ...
Bromine Free PWBs
Bromine-free (or more properly known as "Halogen-free" or"Low-Halogen") and Lead-free are not connected. Lead-free requirements are related to the EU ...
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Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
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The Essential Guide for High-Reliability BGA Component Re-balling