circuitnet
Sponsor
Master Bond
Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond
UNDI Fabrication for IC Substrates
Sponsor
KYZEN
Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
KYZEN
Ask the Experts Member
QUESTIONS
  
SUBMIT
  
MEMBERS
  
JOIN
Kevin Pigeon

Kevin Pigeon

Senior Applications Manager
AIM Solder
Mr. Pigeon has been Senior Applications Manager with AIM Solder for more than 14 years, assisting customers with SMT Printing, Placement, Reflow, Troubleshooting, and Optimization as well as thorough knowledge of wave and hand solder applications. A combined 30+ years of electronics experience in both OEM and CM Manufacturing.

Kevin Pigeon has submitted responses to the following questions.
Competing Reflow Oven Zones
It is always wise to contact your paste manufacturer's Technical Support for targeted process and profiling assistance. While the profiler ...
Solder Balling Splash After Reflow
Although sometimes related to oxidized paste or paste that sat on the PCB too long before reflow, solder balls are ...
Problems With Large Voids
While these devices provide many benefits there are, of course some challenges as well. The most common of these challenges ...
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
The Essential Guide for High-Reliability BGA Component Re-balling