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Kevin Pigeon


Senior Applications Manager
AIM Solder

Mr. Pigeon has been Senior Applications Manager with AIM Solder for more than 14 years, assisting customers with SMT Printing, Placement, Reflow, Troubleshooting, and Optimization as well as thorough knowledge of wave and hand solder applications. A combined 30+ years of electronics experience in both OEM and CM Manufacturing.

Kevin Pigeon has submitted responses to the following questions.
Competing Reflow Oven Zones
It is always wise to contact your paste manufacturer's Technical Support for targeted process and profiling assistance. While the profiler ...
Solder Balling Splash After Reflow
Although sometimes related to oxidized paste or paste that sat on the PCB too long before reflow, solder balls are ...
Problems With Large Voids
While these devices provide many benefits there are, of course some challenges as well. The most common of these challenges ...
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BEST-Inc.

Optimizing BGA Rework: Challenges, Techniques and Quality Control
The complexity of BGA packages introduces challenges during rework requiring innovative methods and inspection practices to ensure performance and reliability. Read more.
BEST Inc.
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