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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Precision Control for BGA Rework
Vacuum sensing electronics provide control for gentle, automatic component removal while a non-contact site cleaning tip's height is accurately monitored and maintained.
Air-Vac Engineering
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Ask the Experts Member |
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Kevin Pigeon
Senior Applications Manager
AIM Solder
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Mr. Pigeon has been Senior Applications Manager with AIM Solder for more than 14 years, assisting customers with SMT Printing, Placement, Reflow, Troubleshooting, and Optimization as well as thorough knowledge of wave and hand solder applications. A combined 30+ years of electronics experience in both OEM and CM Manufacturing.
Kevin Pigeon has submitted responses to the following questions.
Competing Reflow Oven Zones
It is always wise to contact your paste manufacturer's Technical Support for targeted process and profiling assistance. While the profiler ...
Problems With Large Voids
While these devices provide many benefits there are, of course some challenges as well. The most common of these challenges ...
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