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Optically Clear Nanosilica Filled Epoxy
Master Bond EP4NS-80 is a low viscosity epoxy for bonding and sealing that possesses excellent dimensional stability, low CTE and minimal shrinkage upon curing.
Master Bond
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Ask the Experts Member |
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Kevin Pigeon
Senior Applications Manager
AIM Solder
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Mr. Pigeon has been Senior Applications Manager with AIM Solder for more than 14 years, assisting customers with SMT Printing, Placement, Reflow, Troubleshooting, and Optimization as well as thorough knowledge of wave and hand solder applications. A combined 30+ years of electronics experience in both OEM and CM Manufacturing.
Kevin Pigeon has submitted responses to the following questions.
Competing Reflow Oven Zones
It is always wise to contact your paste manufacturer's Technical Support for targeted process and profiling assistance. While the profiler ...
Problems With Large Voids
While these devices provide many benefits there are, of course some challenges as well. The most common of these challenges ...
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Is My PCB Wash Concentration in Check
Evaluating wash concentration levels through varying testing methods can potentially save process time, reduce overall process costs, and increase cleaning efficacy on PBCs. Read more.
KYZEN
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