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Low Pressure Plasma for Electronics
Expand your knowledge of plasma technology. Register now for the new PlasmaTalk webinar to learn how low-pressure plasma can advance your production.
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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
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Ask the Experts Member |
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Kevin Pigeon
Senior Applications Manager
AIM Solder
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Mr. Pigeon has been Senior Applications Manager with AIM Solder for more than 14 years, assisting customers with SMT Printing, Placement, Reflow, Troubleshooting, and Optimization as well as thorough knowledge of wave and hand solder applications. A combined 30+ years of electronics experience in both OEM and CM Manufacturing.
Kevin Pigeon has submitted responses to the following questions.
Competing Reflow Oven Zones
It is always wise to contact your paste manufacturer's Technical Support for targeted process and profiling assistance. While the profiler ...
Problems With Large Voids
While these devices provide many benefits there are, of course some challenges as well. The most common of these challenges ...
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