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Probe card manufacturer relies on mobile real-time x-ray inspection to verify the quality of its aligned probes at different stages along the assembly line.
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Ask the Experts Member

Aaron Caplan

Director of Marketing & Training
PACE Worldwide

Mr. Caplan has been involved in electronics manufacturing technology since the 80's, is an acknowledged expert in Miniature/Microminiature Electronics Repair, and provides technical expertise in teaching of non-destructive PCB rework/repair techniques, educating industry on how to properly utilize these techniques.

Aaron Caplan has submitted responses to the following questions.

Point to Pint Soldering vs Drag Soldering
Drag soldering, sometimes called the Miniwave technique or multi-lead soldering, is a popular method used to install QFP's and other ...

How To Reduce Solder Joint Voids in QFN Components
During QFN rework, stencil design is critical to reducing solder joint voiding. We have had great success with a stencil ...

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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS