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Aaron Caplan
Director of Marketing & Training
PACE Worldwide
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Mr. Caplan has been involved in electronics manufacturing technology since the 80's, is an acknowledged expert in Miniature/Microminiature Electronics Repair, and provides technical expertise in teaching of non-destructive PCB rework/repair techniques, educating industry on how to properly utilize these techniques.
Aaron Caplan has submitted responses to the following questions.
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Touch Free BGA Solder Ball Removal
Watch a video that shows touch-free BGA component deballing. This precision process is highly reliable when preparing BGA components prior to reballing.
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