Sponsor

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp

Sponsor

vCONNECT: Your Next Level of Digital Connectivity
Discover vCONNECT: Analyze inspection data, monitor machine performance, predict maintenance needs, store data securely and access AI tools and the latest Viscom News.
Viscom SE

Ask the Experts Member

Aaron Caplan

Director of Marketing & Training
PACE Worldwide

Mr. Caplan has been involved in electronics manufacturing technology since the 80's, is an acknowledged expert in Miniature/Microminiature Electronics Repair, and provides technical expertise in teaching of non-destructive PCB rework/repair techniques, educating industry on how to properly utilize these techniques.

Aaron Caplan has submitted responses to the following questions.

Point to Pint Soldering vs Drag Soldering
Drag soldering, sometimes called the Miniwave technique or multi-lead soldering, is a popular method used to install QFP's and other ...

How To Reduce Solder Joint Voids in QFN Components
During QFN rework, stencil design is critical to reducing solder joint voiding. We have had great success with a stencil ...

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Sponsor

Defluxing Ultra-Fine Pitch CoW Devices? Read This.
DI water falls short on copper pillar packages. Get proven cleaning parameters for CoW devices with <25μm pitch in our white paper.
ZESTRON Americas