Sponsor

X-Ray Inspection Verifies Quality of Complex PCBs
A Netherlands-based PCB supplier relies on real-time X-ray inspection to ensure the quality of HDI, hybrid, multi- layer, flex-rigid & other complex boards.
Glenbrook Technologies

Sponsor

Pioneering 3D X-ray Inspection for Flat Assemblies
Viscom is setting a new standard for high-precision inline X-ray inspection of printed circuit boards with its iX7059 product line. Learn more.
Viscom

Ask the Experts Member

Aaron Caplan

Director of Marketing & Training
PACE Worldwide

Mr. Caplan has been involved in electronics manufacturing technology since the 80's, is an acknowledged expert in Miniature/Microminiature Electronics Repair, and provides technical expertise in teaching of non-destructive PCB rework/repair techniques, educating industry on how to properly utilize these techniques.

Aaron Caplan has submitted responses to the following questions.

Point to Pint Soldering vs Drag Soldering
Drag soldering, sometimes called the Miniwave technique or multi-lead soldering, is a popular method used to install QFP's and other ...

How To Reduce Solder Joint Voids in QFN Components
During QFN rework, stencil design is critical to reducing solder joint voiding. We have had great success with a stencil ...

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Touch Free BGA Solder Ball Removal
Watch a video that shows touch-free BGA component deballing. This precision process is highly reliable when preparing BGA components prior to reballing.
Circuit Technology Center

High-Density Rigid PCB Boards

Summit's rigid capabilities include HDI high-layer count boards, staggered microvias, blind/buried vias, multiple sequential lam, via fill, metal backed/metal core, and oversized panel options.

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