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Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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Aaron Caplan

Aaron Caplan

Director of Marketing & Training
PACE Worldwide
Mr. Caplan has been involved in electronics manufacturing technology since the 80's, is an acknowledged expert in Miniature/Microminiature Electronics Repair, and provides technical expertise in teaching of non-destructive PCB rework/repair techniques, educating industry on how to properly utilize these techniques.

Aaron Caplan has submitted responses to the following questions.
Point to Point Soldering vs Drag Soldering
Drag soldering, sometimes called the Miniwave technique or multi-lead soldering, is a popular method used to install QFP's and other ...
How To Reduce Solder Joint Voids in QFN Components
During QFN rework, stencil design is critical to reducing solder joint voiding. We have had great success with a stencil ...
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Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
The Essential Guide for High-Reliability BGA Component Re-balling