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Master Bond
Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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UNDI Fabrication for IC Substrates
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KYZEN
Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
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Jim Hall

Jim Hall

Principal Consultant
ITM Consulting
Jim has a wealth of knowledge in soldering and thermal technology, equipment and process basics and is a pioneer in the science of reflow technology.

Jim Hall has submitted responses to the following questions.
Insufficient Barrel Fill on Through-hole Components
We have a Board Talk segment on this topic. See: https://www.circuitinsight.com/programs/54395.html
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Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
The Essential Guide for High-Reliability BGA Component Re-balling