I only have
experience with Intrusive reflow pin in hole. In this case too big of a
pin to hole ratio leads to voids. 25 mil pin in 48 and 44 hole leas to
voids where 25 pin in 40 and 36 hole was OK. Maybe it is reversed for
wave since wave must fill in around pin. For Intrusive reflow the paste
is already in the hole.
Vice President Technology
For over 18 years, Dr. Coleman has been the vice president of technology for Photo Stencil, working closely with customers to understand their printing requirements. His efforts have resulted in several new stencil products.
It is very hard to answer this question. Board thickness, pin
size, thermal relief and more play a role. One company for small
electrolytic caps with a .024 pin size use a 0.049 hole. A large electrolytic
with a 0.032 pin may require a 0.070 hole.
There is an open
project by one of the consortia evaluating this question currently.
Chairman of the IPC Technology Roadmap Committee
Interconnect. Technology Analysis Inc.
Jack Fisher is a retired IBM executive, chairman of the roadmap since 1994, and member of IPC Hall of Fame.
If you search for generic recommendations on how much over-size
your hole needs to be, you'll find a wide range of sometimes-conflicting
results. The reason is that some of the recommendations are focused on
auto-insertion needs, while others are based on optimizing the soldering operation,
and some incorporate both. To complicate matters, the solder alloy to be used
has a big impact, as does the pin shape (round, square, flat). For a round
lead, if your diameter is 0.008" to 0.015" over the pin diameter, you're
probably not in big trouble. Where the optimum lies depends on a lot of
Let's talk about what can impact flow-through:
of the partly-filled holes can be informative. Are holes on ground pins more
problematic? Is there evidence of wetting (low contact angle)to the hole wall,
but a high contact angle to the lead, or vice versa? Are particular components
more susceptible? Can flux penetration be verified? The answers may guide you
toward one or more root causes.
- Lack of adequate heat transfer up the lead and barrel. Both the
barrel and the lead must reach soldering temperature throughout the PWB
thickness, or solder flow up the barrel will be halted. Problems can be caused
by lack of lead protrusion, too many ground plane connections to the PTH or
insufficient thermal relief on ground connections, too low solder temperature
or too-short contact time.
- Slow or absent wetting. Both the lead surface and the hole wall
must be made wettable by a flux in order for a capillary force to be
generated that will cause the solder to flow up the hole. Wetting problems can
be caused by poorly-solderable surface finishes, lack of flux penetration, or
improper pre-heat (either too-aggressive or insufficient), or contamination of
hole walls or leads.
Fritz's career in electronics manufacturing has included diverse engineering roles including PWB fabrication, thick film print & fire, SMT and wave/selective solder process engineering, and electronics materials development and marketing. Fritz's educational background is in mechanical engineering with an emphasis on materials science. Design of Experiments (DoE) techniques have been an area of independent study. Fritz has published over a dozen papers at various industry conferences.
is a difficult number to find in the "standards."|
can tell you that board designers have a "rule of thumb" for the finished hole
diameter which is: 0.016" (0.4mm) larger that the component lead. This gives
0.008" (0.2mm) clearance around the component lead for solder to wick.
As for the standards,
the IPC would be the best place to search for this information.
Senior Project Engineer
Electronic Controls Design Inc
Paul been with Electronic Controls Design Inc. (ECD) in Milwaukie, Oregon for over 34 years as a Senior Project Engineer. He has seen and worked with the electronic manufacturing industry from many points of view, including: technician, designer, manufacture, and customer. His focus has been the design and application of thermal process measurement tools used to improve manufacturing processes like: mass reflow and wave soldering, bread baking, paint and powder curing, metal heat treatment and more.
Circuit community recommendations range from .005" to .020" with
.015" being commonly listed as a target.|
Given that you need to play the hand you are dealt, I would
suggest a couple of strategies for the existing boards:
Additional flux may
be accomplished by pre dipping the component leads in flux prior to board
- Preheat the board if possible to eliminate thermal lag
- Pre-tin the component to improve wetting speed
- Use additional flux to improve capillary action and improve
Minco Products Inc
Nick has been in the circuit industry since 1985, in technical and management roles. Nick is the Vice Chair of the IPC Flexible Circuits Committee, and Chair of IPC 6013 Flexible Circuits Perfomance Subcommittee. Nick holds a Bachelors Degree in Mechanical Engineering and a Masters Degree in the Management of Technology from the University of Minnesota.
Guidance from IPC-2222 Revision A|
For better fill, some possible solutions are:
a slower conveyor speed on the wave solder
a higher operating temperature
Lockheed Martin Space Systems
Mike Green is co-chairman of the IPC Terms and Definitions Committee. He has been working with board design and manufacturing for 33 years.
I am sure you will
get plenty of practical advise from wave soldering experts. One thing I
would like to introduce is the thought that it may not be necessary to wave
solder the component. It may be possible to reflow solder the through
hole component at the same time as the SMT components, using printed solder
There are a few things to consider, such as peak temperature
capability of the component and component standoff height to provide clearance
for the solder paste. Press fit or near press fit connectors don't reflow
solder well, since the solder needs a reasonable clearance to flow freely
during reflow. The advantage is that 100% hole fill can be routinely
achieved, since issues such as temperature gradients top side verses bottom
side, barrel connections to internal planes that act like heat sinks no longer
apply, since the entire board achieves the same temperature while in the reflow
If there isn't enough board real estate to print sufficient solder
volume for each pin, solder preforms from tape and reel packaging can be
considered as a method to augment the solder volume. The elimination of
wave soldering is a significant industry trend, and may represent the most
significant cost savings opportunity since low silver solder was introduced. It is worth examining, especially if you have a problematic board that
does not achieve sufficient hole fill with the wave process.
Paul J. Koep
Global Product Manager
Mr. Koep is responsible for product planning and technical marketing for the Preform Products at Alpha. He is the co-author of several patents in the areas of soldering applications focusing on reflow and alternative methods.
The answer is 'it
The IPC has an
inspection standard for finished assemblies and I think it is 610 off the top
of my head, this will have different pass / fail standards depending on the
class of product you are producing, but generally this will range from 60 -
100% depending on what you are producing. You then need to determine how you
will measure this and X-ray is the only real way without cutting up the
Global Product Champion
Richard Boyle is a Global Product Champion at Henkel Electronics. He has over 25 years experience in the electronics assembly industry and is responsible for the global technical service of all of Henkel's solder materials.