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Experts Questions
0201 Pick & Place Nozzle Plugging
We are assembling PCBA's containing 0201 passive components. We have a problem with solder paste getting in the 0201 P&P nozzles and plugging them up ...
Responses by:
Georgian Simion, Engineering and Operations Management, Independent Consultant
Brien Bush, Manufacturing Applications Specialist, Cirtronics Corp.
Mitch Holtzer, Global Director of Customer Technical Support, Alpha Assembly Solutions
Bob Black, President and CEO, Juki Corporation
Fritz Byle, Process Engineer, Astronautics
Chris Ellis, Sales Manager, Manncorp
Eric Bastow, Senior Technical Support Engineer, Indium Corporation
Class 3 Cleaning Requirements
We recently received our first contract to assemble Class 3 circuit board assemblies. Are there any changes ...
Responses by:
Steve Stach, President, Austin American Technology
Umut Tosun, Application Technology Manager, Zestron America
Fritz Byle, Process Engineer, Astronautics
Mike Konrad, President, Aqueous Technologies
Rick Perkins, Chemical Engineer / Owner, Chemical Logic Inc.
Deionized Water Sample Testing
We have an in-line sensor connected to a resistivity meter at the exit pipe of our deionized water system. The resistivity ...
Responses by:
Neil Poole, Senior Applications Chemist, Henkel Electronics
Charlie Pitarys, Inside Sales Technical Manager, Kyzen Corporation
Doug Pauls, Principal Materials and Process Engineer, Rockwell Collins
Lee Wilmot, Director, EHS, TTM Technologies
Pierce Pillon, Laboratory Mgr., Techspray
Gerard O'Brien, President, S T and S Testing and Analysis
Jerry Karp, President, JSK Associates
John Sharp, Corporate Product Compliance Manager, TriQuint Semiconductor, Inc.
Fritz Byle, Process Engineer, Astronautics
Leo Lambert, Vice President, Technical Director, EPTAC Corporation
Paul Austen, Senior Project Engineer, Electronic Controls Design Inc
David Bonito, Sales & Marketing Manager, Technical Manufacturing Corp.
Soldering Components with Silver Pads
We need to attach a component to a PCB. The component has silver pads. Our normal process is to use a reflow oven. We are concerned that silver will leach into the solder joints ...
Responses by:
Georgian Simion, Engineering and Operations Management, Independent Consultant
Eric Bastow, Senior Technical Support Engineer, Indium Corporation
Fritz Byle, Process Engineer, Astronautics
Kishan Sarjoo, Process Engineering Manager - Electronics, Altech UEC, South Africa
Tony Lentz, Field Applications, FCT Assembly
Gerard O'Brien, President, S T and S Testing and Analysis
Hand Soldering vs. Selective Wave for small LCD
An LCD glass display with 44 pins, 22 per side is soldered to the PCB using a manual soldering process. We are experiencing problems while soldering with a 700 degree F iron tip ...
Responses by:
EH Lim, Managing Director, Asia Pacific, ECD
James Mahoney, Applications Project Manager, Quick Turn Flex Circuits LLC
Karthik Vijay, Technical Manager - Europe, Indium Corp.
Jess Baker, President, RPS Automation
Jeff Fouche, Design Engineer, ACE Production Technologies
Gary Goldberg, President and CEO, PROMATION, Inc.
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