We search for industry news, so you don't need to.
Ask the Experts arrow   Page 1 of 159   arrow
Questions Index  ■  Submit a Question  ■  Experts Panel  ■  Join the Panel

Experts Questions
Conformal Coating Cross Contamination
We apply 3 different types of conformal coating: Acrylic, Polyurethane and Silicone. We use designated dispensing systems for each, but cure them all in a single oven.
Responses by:
Lee Hitchens, Owner, SCH Technologies
Chris Palin, European Manager, HumiSeal
Jim Williams, Chairman, Polyonics, Inc.
Wayne Wagner, President, Krayden Inc.
Bryan Kerr, Principal Engineer - CMA Lab, BAE Systems
Cause of Green/Blue Oxide Buildup
My organization is responsible for performing depot level repair to circuit card assemblies. We are encountering some serious oxide buildup, green and blue in color, on circuit cards ...
Responses by:
Steve Stach, President, Austin American Technology
Lee Wilmot, Director, EHS, TTM Technologies
Fritz Byle, Process Engineer, Astronautics
Neil Poole, Senior Applications Chemist, Henkel Electronics
SMT Component Lead Oxidation
How do you suggest we remove oxidization from SMT component leads? The component leads are seriously oxidized due to long time storage.
Responses by:
Georgian Simion, Engineering and Operations Management, Independent Consultant
Alan Cable, President, ACE Production Technologies
Mark McMeen, VP Engineering Services, STI Electronics Inc.
Edward Zamborsky, Regional Sales Manager, OK International Inc.
Bryan Kerr, Principal Engineer - CMA Lab, BAE Systems
Sandip Thakor, Quality Engineer, Matrix Telecom Solution P Ltd
Floor Life of MSD Parts
We run small jobs so a reel of MSD components could be opened and closed a number of times. Each time we put a new desiccant pack and new humidity indicator card in the MSD bag and seal it. ...
Responses by:
Georgian Simion, Engineering and Operations Management, Independent Consultant
Leo Lambert, Vice President, Technical Director, EPTAC Corporation
Edithel Marietti, Senior Manufacturing Engineer, iDirect
Fritz Byle, Process Engineer, Astronautics
Paul Austen, Senior Project Engineer, Electronic Controls Design Inc
Richard Heimsch, Director, Protean Marketing
Through Hole Connector Solder Joint Hole Fill
When looking at IPC610D in relation to through hole connectors and Class III level soldering. What is the recommended inspection method to ensure the 75% fill requirement is being met. For many through hole connectors one side is totally covered.
Responses by:
Bill Coleman, Vice President Technology, Photo Stencil
Subrat Prajapati, Supplier Quality Leader, Ge Healthcare
Leo Lambert, Vice President, Technical Director, EPTAC Corporation
Richard D. Stadem, Advanced Engineer/Scientist, General Dynamics
Peter Biocca, Senior Market Development Engineer, Kester
Fritz Byle, Process Engineer, Astronautics
Paul J. Koep, Global Product Manager, Alpha
Robert Freid, President and Founder, Contract Manufacturing Consultants, Inc.
Kris Roberson, Manager of Assembly Technology, IPC
image