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Experts Questions
Legend Marking Discoloration
We are replacing LEDs damaged during the manufacturing process. During the rework process the legend surrounding the rework site, plus the legend indicating the part number is darkening. The difference ...
Responses by:
Richard D. Stadem, Advanced Engineer/Scientist, General Dynamics
Stephen Schoppe, President, Process Sciences, Inc.
Leo Lambert, Vice President, Technical Director, EPTAC Corporation
Fritz Byle, Process Engineer, Astronautics
Georgian Simion, Engineering and Operations Management, Independent Consultant
Al Cabral, Regional Sales Manager , Finetech
Zip-lock Bags vs. Heat Sealed Bags
Are zip-lock bags vs. heat sealed bags an acceptable option for storage of moisture sensitive components?
Responses by:
Subrat Prajapati, Supplier Quality Leader, Ge Healthcare
Paul Austen, Senior Project Engineer, Electronic Controls Design Inc
Umut Tosun, Application Technology Manager, Zestron America
Fritz Byle, Process Engineer, Astronautics
Rick Perkins, President, Chem Logic
Jerry Karp, President, JSK Associates
BGA Component Moisture Exposure
We mistakenly assembled circuit boards using BGA components that were not properly stored. The BGA components had moisture tags that show indication of moisture exposure. All the assemblies passed ...
Responses by:
Georgian Simion, Engineering and Operations Management, Independent Consultant
Francois Monette, VP Sales & Marketing, Cogiscan
Mitch DeCaire, Sales Manager (Americas), Cogiscan, Inc.
Scott D. Szymanski, Global Marketing Manager, Nordson MARCH
Richard Heimsch, Director, Protean Marketing
Profiling for Double Sided BGA
We are about to produce double sided BGA boards - BGA components on both sides. What advice would you give for profiling? What advice would you give for reworking?
Responses by:
Fritz Byle, Process Engineer, Astronautics
Al Cabral, Regional Sales Manager , Finetech
Paul Austen, Senior Project Engineer, Electronic Controls Design Inc
Roger Gibbs, Managing Director, PDR
Edward Zamborsky, Regional Sales Manager, OK International Inc.
BGA Solder Ball Collapse
Do lead free solder balls collapse the same amount as tin-lead solder balls?
Responses by:
Ray Prasad, President, Ray Prasad Consultancy Group
Fritz Byle, Process Engineer, Astronautics
Rodney Miller, Capital Equipment Operations Manager, Specialty Coating Systems
Robert Freid, President and Founder, Contract Manufacturing Consultants, Inc.