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Experts Questions
Fastening Surface Mounted Connectors Before or After Refow?
Is there an IPC guideline for attachment of SMT or PTH connectors that are hardware mounted? Do you tighten / torque hardware before soldering, or solder then tighten hardware? Could not find guidance ...
Responses by:
Mike Green, Design Engineering, Lockheed Martin Space Systems
Leo Lambert, Vice President, Technical Director, EPTAC Corporation
Terry Jeglum, President/CEO, Electronic Technology Corporation
Fritz Byle, Process Engineer, Astronautics
Rodney Miller, Capital Equipment Operations Manager, Specialty Coating Systems
Garry McGuire, Sr. Engineer, NASA/Marshall Space Flight Center
Kris Roberson, Manager of Assembly Technology, IPC
Gold Edge Contact Flux Contamination Failures
We received some returned circuit board assemblies that failed after some time in the field. These assemblies were originally processed using no-clean flux. The assemblies had visible contamination ...
Responses by:
Umut Tosun, Application Technology Manager, Zestron America
Charlie Pitarys, Technical Expert Sales Support, Kyzen Corporation
Richard D. Stadem, Advanced Engineer/Scientist, General Dynamics
Rodney Miller, Capital Equipment Operations Manager, Specialty Coating Systems
Brian Smith, General Manager - Electronic Assembly Americas, DEK International
Lee Levine, President, Consultant, Process Solutions Consulting Inc.
Peter Biocca, Senior Market Development Engineer, Kester
David Bergman, VP International Relations, IPC
Rick Perkins, President, Chem Logic
Kris Roberson, Manager of Assembly Technology, IPC
Opens at BGA Component Corner Balls
We have been stumped by occasional opens at the corner balls of some BGA components after reflow. We have experimented with many minor adjustments, yet this occasional problem continues. Do you have ...
Responses by:
Subrat Prajapati, Supplier Quality Leader, Ge Healthcare
Richard Boyle, Global Product Champion, Henkel Electronics
Karl Seelig, , Deck Street Consultants
Bill Coleman, Vice President Technology, Photo Stencil
Leo Lambert, Vice President, Technical Director, EPTAC Corporation
Stencil Tension
Our stencil supplier certifies that our stencils have 35 N/cm tension when delivered new. Is it advisable to have a tension meter in our SMT assembly area to test our older ...
Responses by:
Keshava Murthy, Process Engineer, Bosch Automotive Electronics India Ltd.
Bill Coleman, Vice President Technology, Photo Stencil
Stephanie Nash, Director, Integrated Ideas & Technologies, Inc.
Robert Dervaes, V.P. Technology & Engineering, Fine Line Stencil, Inc.
Solder Balling Splash After Reflow
A lot of balls are observed after reflow process along and under SMD components. We have not found the root cause, any ideas are welcome. PCB finish surface: HAL; Solder Paste: SN62MP100AGS90; Reflow oven ...
Responses by:
Georgian Simion, Engineering and Operations Management, Independent Consultant
Edithel Marietti, Senior Manufacturing Engineer, iDirect
Mark Northrup, VP of Advanced Technical Operations, IEC Electronics
Fritz Byle, Process Engineer, Astronautics
Tony Lentz, Field Applications, FCT Assembly
Lee Levine, President, Consultant, Process Solutions Consulting Inc.
Kevin Pigeon, Senior Applications Manager, AIM Solder