circuitnet
Sponsor
kyzen

Is My PCB Wash Concentration in Check
Evaluating wash concentration levels through varying testing methods can potentially save process time, reduce overall process costs, and increase cleaning efficacy on PBCs. Read more.
KYZEN
Nordson-ASYMTEK
Sponsor
ECD

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD

Ask the Experts Member

INDEX
ASK
PANEL
JOIN
image

Mike Green


Design Engineering
Lockheed Martin Space Systems

Mike Green is co-chairman of the IPC Terms and Definitions Committee. He has been working with board design and manufacturing for 33 years.

Mike Green has submitted responses to the following questions.
BGA Joint Voids - Accept or Reject?
Here's my thoughts:That's the rattiest looking BGA joint I've ever seen, and I've seen X-sections of hundreds of BGAs as-received ...
Insufficient Barrel Fill on Through-hole Components
Guidance from IPC-2222 Revision A For better fill, some possible solutions are:a slower conveyor speed on the wave solder a ...
Fastening Surface Mounted Connectors Before or After Refow?
Applying torque to the fasteners of a connector that has been previously soldered will in part stress to the solder ...
Acceptable Conductor Repair
See IPC 7721, 4.2.4 Conductor Repair Surface Wire Method for a methodology. But, this method may not be acceptable for ...
Soldering Multilayer Ceramic Chip Capacitors
You need a controlled thermal environment to avoid cracking the ceramic for both soldering operations. Use reflow with a controlled ...
Soldering Wires to SMT Pads
We have a library part for #22 AWG that is .040 X .060. Our requirements are .050 minimum solder joint ...
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Master-Bond

Thermally Conductive Epoxy
Master Bond Supreme 11AOHTLP is a two component adhesive featuring thermal conductivity and electrical insulation for high performance bonding, sealing and coating.
Master Bond
Circuitnet Advertising Delivers Results!