|Ask the Experts Member|
Lockheed Martin Space Systems
Mike Green is co-chairman of the IPC Terms and Definitions Committee. He has been working with board design and manufacturing for 33 years.
BGA Joint Voids - Accept or Reject?
Here's my thoughts:That's the rattiest looking BGA joint I've ever seen, and I've seen X-sections of hundreds of BGAs as-received ...
Insufficient Barrel Fill on Through-hole Components
Guidance from IPC-2222 Revision A For better fill, some possible solutions are:a slower conveyor speed on the wave solder a ...
Fastening Surface Mounted Connectors Before or After Refow?
Applying torque to the fasteners of a connector that has been previously soldered will in part stress to the solder ...
Acceptable Conductor Repair
See IPC 7721, 4.2.4 Conductor Repair Surface Wire Method for a methodology. But, this method may not be acceptable for ...
Soldering Multilayer Ceramic Chip Capacitors
You need a controlled thermal environment to avoid cracking the ceramic for both soldering operations. Use reflow with a controlled ...
Soldering Wires to SMT Pads
We have a library part for #22 AWG that is .040 X .060. Our requirements are .050 minimum solder joint ...
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