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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD

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Scoring Big With Glenbrook's Real-Time X-Ray Inspection
Jewel Box 70T helps East/West Manufacturing ensure accurate assembly of complex boards, for a system delivering statistics in seconds. Read more
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Ask the Experts Member

Jack Fisher

Chairman of the IPC Technology Roadmap Committee
Interconnect. Technology Analysis Inc.

Jack Fisher is a retired IBM executive, chairman of the roadmap since 1994, and member of IPC Hall of Fame.

Jack Fisher has submitted responses to the following questions.

Copper Dissolution Rate
The High Density Packaging Users Group(HDPug) has just completed a copper dissolution study. The final report is still being written ...

Insufficient Barrel Fill on Through-hole Components
It is very hard to answer this question. Board thickness, pin size, thermal relief and more play a role. One ...

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Depaneling machine for separating circuit boards
SCHUNK offers solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling.
SCHUNK