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Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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Jack Fisher

Jack Fisher

Chairman of the IPC Technology Roadmap Committee
Interconnect. Technology Analysis Inc.
Jack Fisher is a retired IBM executive, chairman of the roadmap since 1994, and member of IPC Hall of Fame.

Jack Fisher has submitted responses to the following questions.
Copper Dissolution Rate
The High Density Packaging Users Group(HDPug) has just completed a copper dissolution study. The final report is still being written ...
Insufficient Barrel Fill on Through-hole Components
It is very hard to answer this question. Board thickness, pin size, thermal relief and more play a role. One ...
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Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
The Essential Guide for High-Reliability BGA Component Re-balling