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Introduce your technology, new products or services in our daily e-mail newsletter & website to see how a digital advertising campaign can deliver results. Reach over 200,000 professionals.
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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom

Ask the Experts Member

Jack Fisher

Chairman of the IPC Technology Roadmap Committee

Interconnect. Technology Analysis Inc.

Jack Fisher is a retired IBM executive, chairman of the roadmap since 1994, and member of IPC Hall of Fame.

Jack Fisher has submitted responses to the following questions.

Copper Dissolution Rate
The High Density Packaging Users Group(HDPug) has just completed a copper dissolution study. The final report is still being written ...

Insufficient Barrel Fill on Through-hole Components
It is very hard to answer this question. Board thickness, pin size, thermal relief and more play a role. One ...

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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp