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Need a Profiler Plan B?
Tired of having to share a thermal profiler across different soldering operations? Add the affordable V-M.O.L.E. 2 four-channel profiler to the mix for time-saving efficiency.
ECD
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Seven Facilities, One Trusted Source
Partner with the industry leader. Summit is trusted and proven, with 7 integrated facilities to load capacity—from fast-turn prototypes to scalable production requirements.
Summit Interconnect
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Ask the Experts Member |
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Jack Fisher
Chairman of the IPC Technology Roadmap Committee
Interconnect. Technology Analysis Inc.
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Jack Fisher is a retired IBM executive, chairman of the roadmap since 1994, and member of IPC Hall of Fame.
Jack Fisher has submitted responses to the following questions.
Copper Dissolution Rate
The High Density Packaging Users Group(HDPug) has just completed a copper dissolution study. The final report is still being written ...
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Get the Revisiting Underfill Handbook
Today's underfill applications are constantly evolving. As chip populations increase, dispensing applications must deliver smaller amounts of fluid with precision. Read this handbook.
Nordson Electronics Solutions
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