| Sponsor |
|
Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
|
|
| Sponsor |
|
5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.
|
|
Ask the Experts Member |
|
|
Jack Fisher
Chairman of the IPC Technology Roadmap Committee
Interconnect. Technology Analysis Inc.
|
Jack Fisher is a retired IBM executive, chairman of the roadmap since 1994, and member of IPC Hall of Fame.
Jack Fisher has submitted responses to the following questions.
Copper Dissolution Rate
The High Density Packaging Users Group(HDPug) has just completed a copper dissolution study. The final report is still being written ...
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
|
|
|
