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Replace Slow Curing Gaskets
Cure Form-in-Place gaskets in under 15 seconds with UV/LED light, even to 1/4-inch-thick beads. Replace labor-intensive methods, improve yield.
Dymax
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Let our contract cleaning services help
If you have a technical cleaning question, or if you are facing process challenges or performance challenges, use this technical hotlist form to get help from a KYZEN Technical Care Expert.
KYZEN
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Jack Fisher
Chairman of the IPC Technology Roadmap Committee
Interconnect. Technology Analysis Inc.
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Jack Fisher is a retired IBM executive, chairman of the roadmap since 1994, and member of IPC Hall of Fame.
Jack Fisher has submitted responses to the following questions.
Copper Dissolution Rate
The High Density Packaging Users Group(HDPug) has just completed a copper dissolution study. The final report is still being written ...
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