April 26, 2018
Copper Dissolution Rate
Does anyone have data on the rate of copper
dissolution in solder? Have any studies been done on time/temperature and amount
of copper. It's easy to claim that SnPb dissolves Cu but everybody has a
different opinion on the rate and amount.
right... everyone seems to have a different number for the rate. This is because
the test methods used vary so widely. There are multiple factors that affect
the dissolution rate:
different test methods have been presented in the past decade, including
surface trace dissolution, wire dissolution, and pad dissolution. All are
workable, though they may lead to systematic differences in results. As an
example, Hunt, et. Al (APEX 2009) reported a figure of 1.2um/s (0.047 mils/s)
for SnPb solder at 255C, whereas my work with Denis Jean and Dale Lee reported
at SMTAI 2006 found a rate of 0.89um/s (0.035 mils/s) for a temperature of
- The solder alloy (we'll ignore this here since we are talking
specifically about SnPb)
- The solder temperature
- The solder contamination levels (how much copper is already
- The solder flow, including flow velocity and turbulence
- The copper foil type (microstructure of the copper has a
Both rates were determined using foil dissolution from a PWB coupon,
ours using a trace, and Hunt's using a pad. The rate differences found were
most likely due mostly to flow, but also may have been influenced by foil type.
Fritz's career in electronics manufacturing has included diverse engineering roles including PWB fabrication, thick film print & fire, SMT and wave/selective solder process engineering, and electronics materials development and marketing. Fritz's educational background is in mechanical engineering with an emphasis on materials science. Design of Experiments (DoE) techniques have been an area of independent study. Fritz has published over a dozen papers at various industry conferences.
The High Density Packaging Users Group(HDPug) has just completed a copper
dissolution study. The final report is still being written but all data is
collected. Potentially some of this data may be available to the industry.
Chairman of the IPC Technology Roadmap Committee
Interconnect. Technology Analysis Inc.
Jack Fisher is a retired IBM executive, chairman of the roadmap since 1994, and member of IPC Hall of Fame.
The testing is done by dipping a metal cylinder into an infinite
amount of solder bath (no significant composition change). The radius reduction
rate is used to indicate the dissolution of various elements in the solder
bath. In real reflow process, the interfacial IMC growth and the solder joint
composition variation due to surface material leaching may lead to a different
Technical Support Engineer
Kay Parker is a Technical Support Engineer based at Indium Corporation's headquarters in Clinton, N.Y. In this role she provides guidance and recommendations to customers related to process steps, equipment, techniques, and materials. She is also responsible for servicing the company's existing accounts and retaining new business.
question on the dissolution rate: I've listed a few places where information is
available for you to research.
rate of dissolution is based upon a variety of parameters of which, is the
Lead-Free alloy used, the temperature of the wave and the type of copper being
dissolved be it either copper foil or electroplated copper for the plated
through holes and such.
See more info at:
Vice President, Technical Director
At EPTAC Corporation, Mr. Lambert oversees content of course offerings, IPC Certification programs and provides customers with expert consultation in electronics manufacturing, including RoHS/WEEE and lead free issues. Leo is also the IPC General Chairman for the Assembly/Joining Process Committee.
There are many factors
which effect the rate of Cu dissolution such as solder flow rate, alloy type,
copper type and of course soldering temperature and contact or dwell
As stated it was known that SnPb did dissolve copper, although at a
low rate, and with the introduction of SAC alloys to address RoHS it was found
these alloys had a much higher rate of copper dissolution than SnPb.
There has been several studies performed on copper dissolution especially in
rework mini-wave applications.
Hamilton and Snugovsky of Celestica and
Kelly of IBM published a paper titled "A Study of Copper Dissolution
During Lead Free PTH Rework Using a Thermally Massive Test Vehicle", SMTAi 2006
which shows the comparison between copper dissolution rates of SnPb,
approximately 0.007mils/sec and SAC, approximately 0.035mils/sec for
rework process soldering temperatures.
It was also found for lead-free
alloys, the SnCu nickel modified alloy, SN100C has a copper dissolution rate
similar to SnPb. The paper can be found on the SMTA website,www.smta.org.
Mike Scimeca created FCT Assembly after the purchase of Fine Line Stencil, Inc., and consists of two major operations: stencil manufacturing and the manufacturing of electronic assembly products such as solder paste, flux and solder bar.