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Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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Michelle Ogihara

Michelle Ogihara

Sales and Marketing Manager
Seika Machinery Inc.
Michelle is the Sales and Marketing Manager of Seika Machinery, Inc. She is an active member of the SMTA taking on a past position as Chapter President and currently Secretary, Co-Chairs the MSD Council and serves on several committee positions.

Michelle Ogihara has submitted responses to the following questions.
Depaneling Concerns
Placement of components close to edge of the PCB may cause micro-cracking to occur. Placement of the component in line ...
Component Storage Recommendations
According to IPC/JEDEC-J-STD 033B.1 Table 7-1, all level moisture-sensitive components may be exposed indefinitely in an environment that allows for ...
Stencil Cleaning Alternatives
The Sawa 5000GUS removes solder balls from stencil apertures after normal wipe cleaning. A powerful hand held ultrasonic cleaning head ...
How to Clamp Odd Shaped Circuit Boards
"Routing is the most reliable and low-stress option to depaneling assembled PCBs. Odd shaped and small PCBs can be held ...
PCB Storage Spec
John Perry at IPC has formed IPC D-35 Printed Board Storage and Handling Subcommittee and prepared a draft document IPC1601-Guidance ...
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Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
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The Essential Guide for High-Reliability BGA Component Re-balling