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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE
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Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering
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Ask the Experts Member |
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Bob Neves
CEO/CTO
Microtek Laboratories
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Bob Neves has spent the last 27 years working for Microtek Labs involved in qualification, conformance and failure analysis of PCB's, PCBA's and the materials that go into making them up. Neves has served as the IPC's Rigid Board General Committee Chairman, HDI General Committee Chairman, TAEC Chairman and have served on more than 50 IPC Committees. He was awarded both the IPC's President's Award and Hall of Fame award for service to the electronics industry.
Bob Neves has submitted responses to the following questions.
Solder Popping Out of Holes
Solder "popping"out of holes during the assembly process can be caused by outgassing ofmoisture from the PTH. This is typicallyfacilitated ...
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IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
Alltemated
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