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Bob Neves

Bob Neves

CEO/CTO
Microtek Laboratories
Bob Neves has spent the last 27 years working for Microtek Labs involved in qualification, conformance and failure analysis of PCB's, PCBA's and the materials that go into making them up. Neves has served as the IPC's Rigid Board General Committee Chairman, HDI General Committee Chairman, TAEC Chairman and have served on more than 50 IPC Committees. He was awarded both the IPC's President's Award and Hall of Fame award for service to the electronics industry.

Bob Neves has submitted responses to the following questions.
Solder Popping Out of Holes
Solder "popping"out of holes during the assembly process can be caused by outgassing ofmoisture from the PTH. This is typicallyfacilitated ...
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Advanced Interconnections Corp
Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
Die Module Attach (static)