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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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Ask the Experts Member |
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Bob Neves
CEO/CTO
Microtek Laboratories
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Bob Neves has spent the last 27 years working for Microtek Labs involved in qualification, conformance and failure analysis of PCB's, PCBA's and the materials that go into making them up. Neves has served as the IPC's Rigid Board General Committee Chairman, HDI General Committee Chairman, TAEC Chairman and have served on more than 50 IPC Committees. He was awarded both the IPC's President's Award and Hall of Fame award for service to the electronics industry.
Bob Neves has submitted responses to the following questions.
Solder Popping Out of Holes
Solder "popping"out of holes during the assembly process can be caused by outgassing ofmoisture from the PTH. This is typicallyfacilitated ...
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Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.
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