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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE
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Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering
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Ask the Experts Member |
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Tom Schardt
Industrial Engineer
Red Lion Controls, Inc.
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Tom Schardt has been an Industrial Engineer with Red Lion Controls since 1988 with a degree in Electronics Engineering. He has held the positions of wave solder operator, electronics technician, production assembler, Lead Person and Supervisor. In his current position he is responsible for plant floor design and compliance, implementing new machines and technology, and the selective soldering operation.
Tom Schardt has submitted responses to the following questions.
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IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
Alltemated
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