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Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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Tom Schardt

Tom Schardt

Industrial Engineer
Red Lion Controls, Inc.
Tom Schardt has been an Industrial Engineer with Red Lion Controls since 1988 with a degree in Electronics Engineering. He has held the positions of wave solder operator, electronics technician, production assembler, Lead Person and Supervisor. In his current position he is responsible for plant floor design and compliance, implementing new machines and technology, and the selective soldering operation.

Tom Schardt has submitted responses to the following questions.
Insufficient Barrel Fill on Through-hole Components
Assuming you are hand soldering, you might try a higher wattage soldering iron. Increasing the temperature on a low wattage ...
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Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
The Essential Guide for High-Reliability BGA Component Re-balling