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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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Ask the Experts Member |
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Tom Schardt
Industrial Engineer
Red Lion Controls, Inc.
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Tom Schardt has been an Industrial Engineer with Red Lion Controls since 1988 with a degree in Electronics Engineering. He has held the positions of wave solder operator, electronics technician, production assembler, Lead Person and Supervisor. In his current position he is responsible for plant floor design and compliance, implementing new machines and technology, and the selective soldering operation.
Tom Schardt has submitted responses to the following questions.
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Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.
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